VND830SPTR-E STMicroelectronics, VND830SPTR-E Datasheet
VND830SPTR-E
Specifications of VND830SPTR-E
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VND830SPTR-E Summary of contents
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... Output shorted to V Device automatically turns-off in case of ground pin disconnection. Tube VND830SP-E Doc ID 10879 Rev 2 VND830SP PowerSO-10 pin voltage clamp protects the device CC is detected in the off-state. CC Order codes Tape and reel VND830SPTR-E 1/25 www.st.com 1 ...
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VND830SP-E Contents 1 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 Electrical ...
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VND830SP-E List of tables Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...
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VND830SP-E List of figures Figure 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...
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VND830SP-E 1 Block diagram and pin description Figure 1. Block diagram GND INPUT1 STATUS1 OVERTEMP. 1 INPUT2 STATUS2 OVERTEMP. 2 Figure 2. Configuration diagram (top view) GROUND INPUT 1 STATUS 1 STATUS 2 INPUT 2 Table 2. Suggested connections for ...
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... These are stress ratings only and operation of the device at these or any other conditions above those indicated in the operating sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality document. Table 3. ...
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VND830SP-E 2.2 Thermal data Table 4. Thermal data (per island) Symbol R Thermal resistance junction-case thj-case R Thermal resistance junction-ambient thj-amb 1. When mounted on a standard single-sided FR-4 board with 0 artificial air flow. 2. When mounted ...
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VND830SP-E Table 5. Power output (continued) Symbol (1) I Supply current S I Off-state output current L(off1) I Off-state output current L(off2) I Off-state output current L(off3) I Off-state output current L(off4) 1. Per device. Table 6. Protections Symbol Parameter ...
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VND830SP-E Table 8. Status pin (continued) Symbol V Status clamp voltage SCL Table 9. Switching (V Symbol t Turn-on delay time d(on) t Turn-off delay time d(off) dV /dt Turn-on voltage slope OUT (on) dV /dt Turn-off voltage slope OUT ...
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VND830SP-E Figure 4. Status timings OPEN LOAD STATUS TIMING (with external pull-up) V INn V STATn t DOL(off) Table 12. Truth table Conditions Normal operation Current limitation Overtemperature Undervoltage Overvoltage Output voltage > V Output current < < ...
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VND830SP-E Figure 5. Switching time waveforms Doc ID 10879 Rev 2 Electrical specifications 11/28 ...
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VND830SP-E Table 13. Electrical transient requirements on V ISO T/R 7637/1 test pulse Table 14. Electrical transient requirements on V ISO T/R 7637/1 test pulse Table 15. Electrical ...
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VND830SP-E Figure 6. Waveforms INPUT n OUTPUT VOLTAGE STATUS INPUT n OUTPUT VOLTAGE STATUS INPUT n OUTPUT VOLTAGE STATUS n INPUT n OUTPUT VOLTAGE STATUS n INPUT n OUTPUT VOLTAGE STATUS ...
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VND830SP-E 2.4 Electrical characteristics curves Figure 7. Off-state output current IL(off1) (uA) 2.5 2.25 Off state 2 Vcc=36V Vin=Vout=0V 1.75 1.5 1.25 1 0.75 0.5 0.25 0 -50 - 100 Tc (°C) Figure 9. Input clamp ...
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VND830SP-E Figure 13. On-state resistance vs T Ron (mOhm) 160 140 Iout=2A Vcc=8V; 13V & 36V 120 100 -50 - (°C) Figure 15. Open-load on-state detection threshold Iol (mA) 150 ...
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VND830SP-E Figure 19. Input hysteresis voltage Vhyst (V) 1.5 1.4 1.3 1.2 1.1 1 0.9 0.8 0.7 0.6 0.5 -50 - (°C) Figure 21. Turn-on voltage slope dVout/dt(on) (V/ms) 800 700 Vcc=13V Rl=6.5Ohm 600 500 ...
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VND830SP-E 2.5 Maximum demagnetization energy Figure 24. PowerSO-10 maximum turn-off current versus load inductance (A) 100 single pulse repetitive pulse repetitive pulse at T Conditions: V ...
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VND830SP-E 3 Application schematic Figure 25. Application schematic +5V R prot R C prot R prot R prot 3.1 GND protection network against reverse battery This section provides two solutions for implementing a ground protection network against reverse battery. 3.1.1 ...
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VND830SP-E Please note that, if the microprocessor ground is not shared by the device ground, then the R will produce a shift (I GND values. This shift will vary depending on how many devices are ON in the case of ...
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VND830SP-E 3.4 Open-load detection in off-state Off-state open load detection requires an external pull-up resistor (R OUTPUT pin and a positive supply voltage (V microprocessor. The external resistor has to be selected according to the following requirements false ...
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VND830SP-E 4 Package and PCB thermal data 4.1 PowerSO-10 thermal data Figure 27. PowerSO-10 PC board Note: Layout condition of R thickness = 2 mm, Cu thickness = 35 µm, Copper areas: from minimum pad lay-out ...
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VND830SP-E Figure 29. Thermal impedance junction ambient single pulse Equation 1 pulse calculation formula : where p Figure 30. Thermal fitting model of a double channel HSD in PowerSO-10 Tj_1 Pd1 ...
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VND830SP-E Table 16. Thermal parameters Area / island ( (°C/W) R2 (°C/W) R3 (°C/W) R4 (°C/W) R5 (°C/W) R6 (°C/W) C1 (W.s/°C) C2 (W.s/°C) C3 (W.s/°C) C4 (W.s/°C) C5 (W.s/°C) C6 (W.s/°C) Doc ID 10879 Rev 2 ...
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VND830SP-E 5 Package and packing information ® 5.1 ECOPACK In order to meet environmental requirements, ST offers these devices in different grades of ® ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status ...
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VND830SP-E Table 17. PowerSO-10 mechanical data DIM (1) L (1) 1. Muar ...
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VND830SP-E 5.3 PowerSO-10 packing information Figure 32. PowerSO-10 suggested pad layout Figure 34. PowerSO-10 tape and reel shipment (suffix “TR”) Tape dimensions According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb. 1986 Tape width Tape Hole Spacing Component ...
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VND830SP-E 6 Revision history Table 18. Document revision history Date 01-Oct-2004 07-Feb-2011 Revision 1 Initial release. Document reformatted and restructured. 2 Updated Features list. Updated Table 16: Thermal parameters Doc ID 10879 Rev 2 Revision history Changes 27/28 ...
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... VND830SP-E Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...