MC33926PNB Freescale Semiconductor, MC33926PNB Datasheet - Page 21

• Manufacturer Part Number: MC33926PNB
• Description: IC H-BRIDGE THROTTLE CTRL 32-QFN
• Manufacturer: Freescale Semiconductor
• Type: H Bridger

Specifications of MC33926PNB

• Input Type: Non-Inverting
• Number Of Outputs: 2
• On-state Resistance: 120 mOhm
• Current - Output / Channel: 5A
• Current - Peak Output: 11A
• Voltage - Supply: 5 V ~ 28 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 32-QFN
• Product: H-Bridge Drivers
• Rise Time: 3 us
• Fall Time: 3 us
• Supply Voltage (max): 28 V
• Supply Voltage (min): - 0.3 V
• Supply Current: 80 uA
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Bridge Type: H-Bridge
• Maximum Turn-on Delay Time: 5 ms
• Minimum Operating Temperature: - 40 C
• Number Of Drivers: 4
• Output Current: 5 A
• Output Voltage: 7 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
Introduction
datasheet. The addendum provides thermal performance information that may be
critical in the design and development of system applications. All electrical,
application, and packaging information is provided in the datasheet.
Packaging and Thermal Considerations
heat source (P), a single junction temperature (T
package to another in a standardized environment. This methodology is not meant
to, and will not predict the performance of a package in an application-specific
environment. Stated values were obtained by measurement and simulation
according to the standards listed below.
STANDARDS
Table 6. Thermal Performance Comparison
Analog Integrated Circuit Device Data
Freescale Semiconductor
Notes
R
R
R
R
This thermal addendum is provided as a supplement to the 33926 technical
The 33926 is offered in a 32 pin PQFN, single die package. There is a single
The stated values are solely for a thermal performance comparison of one
θ
θ
θ
θJC
1.
2.
3.
4.
5.
JA
JB
JA
Thermal Resistance
(1),(2)
(2),(3)
(1),
(5)
Per JEDEC JESD51-2 at natural convection, still air
condition.
2s2p thermal test board per JEDEC JESD51-5 and
JESD51-7.
Per JEDEC JESD51-8, with the board temperature on the
center trace near the center lead.
Single layer thermal test board per JEDEC JESD51-3 and
JESD51-5.
Thermal resistance between the die junction and the
exposed pad surface; cold plate attached to the package
bottom side, remaining surfaces insulated.
(4)
T
J
=
R
θJA
[°C/W]
1.0
28
12
80
.
J
), and thermal resistance (R
P
Figure 15. Surface Mount for Power PQFN
θJA
).
Note For package dimensions, refer to
the 33926 data sheet.
with Exposed Pads
THERMAL ADDENDUM (REV 2.0)
8.0 mm x 8.0 mm
ADDITIONAL DOCUMENTATION
98ARL10579D
32-PIN PQFN
PNB SUFFIX
33926
32-PIN
PQFN
0.2
* All measurements
are in millimeters
1.0
0.2
1.0
33926
21