BUK139-50DL,118 NXP Semiconductors, BUK139-50DL,118 Datasheet - Page 5

• Manufacturer Part Number: BUK139-50DL,118
• Description: MOSFET N-CH 50V 16A SOT428
• Manufacturer: NXP Semiconductors
• Series: TOPFET™r
• Type: Low Sider

Specifications of BUK139-50DL,118

• Input Type: Non-Inverting
• Number Of Outputs: 1
• On-state Resistance: 36 mOhm
• Current - Peak Output: 24A
• Mounting Type: Surface Mount
• Package / Case: DPak, TO-252 (2 leads+tab), SC-63
• Configuration: Single
• Transistor Polarity: N-Channel
• Resistance Drain-source Rds (on): 0.1 Ohms
• Drain-source Breakdown Voltage: 50 V
• Continuous Drain Current: 16 A
• Power Dissipation: 65 W
• Maximum Operating Temperature: + 150 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 55 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Supply: -
• Operating Temperature: -
• Current - Output / Channel: -
• Lead Free Status / Rohs Status: Details
• Other names: 934056345118; BUK139-50DL /T3; BUK139-50DL /T3

Philips Semiconductors
MECHANICAL DATA
1 Epoxy meets UL94 V0 at 1/8". Net mass: 1.1 g
July 2001
Logic level TOPFET
D-PAK version of BUK118-50DL
For soldering guidelines and SMD footprint design, please refer to Data Handbook SC18.
Plastic single-ended surface mounted package (Philips version of D-PAK); 3 leads
(one lead cropped)
Note
1. Measured from heatsink back to lead.
DIMENSIONS (mm are the original dimensions)
UNIT
mm
Fig.2. SOT428 surface mounting package
VERSION
OUTLINE
SOT428
max.
2.38
2.22
L 2
A
A 1
0.65
0.45
(1)
b 1
0.89
0.71
A 2
1
e
0.89
0.71
b 2
e 1
IEC
E
b
2
max.
1.1
0.9
b 1
b
5.36
5.26
b 2
3
JEDEC
w
0.4
0.2
D
L
A
c
M
H E
REFERENCES
A
max.
6.22
5.98
D
mounting
0
max.
4.81
4.45
base
D 1
seating plane
L 1
A 1
max.
scale
6.73
6.47
EIAJ
10
5
E
1
c
A 2
, centre pin connected to mounting base.
min.
4.0
A
E 1
20 mm
y
2.285 4.57
e
e 1
E 1
max.
10.4
H E
9.6
2.95
2.55
L
PROJECTION
EUROPEAN
min.
0.5
L 1
D 1
0.7
0.5
L 2
0.2
w
ISSUE DATE
98-04-07
BUK139-50DL
Product specification
max.
0.2
y
SOT428
Rev 2.000