A3955SB-T Allegro Microsystems Inc, A3955SB-T Datasheet - Page 3

IC MOTOR DRIVER PWM FULL 16-DIP

A3955SB-T

Manufacturer Part Number
A3955SB-T
Description
IC MOTOR DRIVER PWM FULL 16-DIP
Manufacturer
Allegro Microsystems Inc
Datasheet

Specifications of A3955SB-T

Applications
Stepper Motor Driver
Number Of Outputs
1
Current - Output
±1.5A
Voltage - Load
4.5 V ~ 50 V
Voltage - Supply
4.5 V ~ 5.5 V
Operating Temperature
-20°C ~ 85°C
Mounting Type
Through Hole
Package / Case
16-DIP (0.300", 7.62mm)
Motor Type
Full Bridge
No. Of Outputs
2
Output Current
1.5A
Output Voltage
50V
Supply Voltage Range
4.5V To 5.5V
Driver Case Style
DIP
No. Of Pins
16
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
620-1067
A3955
Description (continued)
Selection Guide
Absolute Maximum Ratings
Internal circuit protection includes thermal shutdown with hysteresis,
transient-suppression diodes, and crossover-current protection.
Special power-up sequencing is not required.
The A3955 is supplied in a choice of two power packages; a 16-pin
dual-in-line plastic package with copper heat-sink tabs (suffix ‘B’),
Thermal Characteristics
Package Thermal Resistance, Junction
to Ambient
Package Thermal Resistance, Junction
to Tab
*Additional thermal information available on Allegro website.
Load Supply Voltage
Logic Supply Voltage
Logic/Reference Input Voltage Range
Sense Voltage
Output Current, Continuous
Package Power Dissipation
Operating Ambient Temperature
Maximum Junction Temperature
Storage Temperature
A3955SB-T
A3955SLBTR-T
Part Number
Characteristic
Characteristic
16-pin DIP with exposed thermal tabs
16-pin SOICW with internally fused pins
Full-Bridge PWM Microstepping Motor Driver
Symbol
Symbol
T
J
V
I
V
(max)
V
T
R
R
OUT
P
V
T
stg
BB
CC
IN
S
D
A
θJA
θJT
Packing
B Package, single-layer PCB, 1 in.
LB Package, 2-layer PCB, 0.3 in.
side
Output current rating may be limited by duty cycle, ambient
temperature, and heat sinking. Under any set of conditions, do
not exceed the specifi ed current rating or a junction tempera-
ture of 150°C.
Range S
Fault conditions that produce excessive junction temperature
will activate the device’s thermal shutdown circuitry. These
conditions can be tolerated but should be avoided.
and a 16-lead plastic SOIC with internally fused pins (suffix ‘LB’).
For both package styles, the thermally enhanced pins are at ground
potential and need no electrical isolation. Both packages are lead
(Pb) free, with leadframe plating 100% matte tin.
Test Conditions*
Notes
1000 per reel
25 per tube
2
Package
2
2-oz. exposed copper each
2-oz. exposed copper
4
3
2
1
0
25
SUFFIX 'LB', R
50
115 Northeast Cutoff
1.508.853.5000; www.allegromicro.com
Allegro MicroSystems, Inc.
Worcester, Massachusetts 01615-0036 U.S.A.
TEMPERATURE IN °C
SUFFIX 'B', R
θJA
75
= 67°C/W
θJA
R
θJT
100
= 43°C/W
= 6.0°C/W
–0.3 to V
–55 to 150
See graph
–20 to 85
Rating
Value
125
±1.5
150
7.0
1.0
50
43
67
6
CC
+ 0.3
150
Units
Units
ºC/W
ºC/W
ºC/W
ºC
ºC
ºC
W
V
V
V
V
A
2

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