TDF5140AP/C1,112 NXP Semiconductors, TDF5140AP/C1,112 Datasheet - Page 18

• Manufacturer Part Number: TDF5140AP/C1,112
• Description: IC MOTOR DVR BRUSHLESS 18-PDIP
• Manufacturer: NXP Semiconductors
• Type: Brushless DC Motor Controllerr

Specifications of TDF5140AP/C1,112

• Package / Case: 18-DIP (0.300", 7.62mm)
• Mounting Type: Through Hole
• Current - Output: 800mA
• Voltage - Supply: 4 V ~ 18 V
• Operating Temperature: -30°C ~ 70°C
• Applications: DC Motor Driver, Brushless (BLDC), 3 Phase
• Number Of Outputs: 1
• Supply Current: 5 mA
• Mounting Style: Through Hole
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Load: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 935265573112

Philips Semiconductors
Product specification
Brushless DC motor drive circuit
TDF5140A
SOLDERING
Plastic dual in-line packages
B
Y DIP OR WAVE
The maximum permissible temperature of the solder is 260 C; this temperature must not be in contact with the joint for
more than 5 s. The total contact time of successive solder waves must not exceed 5 s.
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the
specified storage maximum. If the printed-circuit board has been pre-heated, forced cooling may be necessary
immediately after soldering to keep the temperature within the permissible limit.
R
EPAIRING SOLDERED JOINTS
Apply the soldering iron below the seating plane (or not more than 2 mm above it). If its temperature is below 300 C, it
must not be in contact for more than 10 s; if between 300 and 400 C, for not more than 5 s.
1999 March 15
18