MC33887DWBR2 Freescale Semiconductor, MC33887DWBR2 Datasheet - Page 34

• Manufacturer Part Number: MC33887DWBR2
• Description: IC H-BRIDGE 5A LOAD FDBK 54-SOIC
• Manufacturer: Freescale Semiconductor
• Type: Half Bridge DC Motor Driverr

Specifications of MC33887DWBR2

• Applications: DC Motor Controller, H Bridge
• Number Of Outputs: 1
• Current - Output: 5A
• Voltage - Supply: 5 V ~ 28 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 54-SOIC (7.5mm Width) Exposed Pad, 54-eSOIC, 54-HSOIC
• Operating Supply Voltage: 5 V to 40 V
• Mounting Style: SMD/SMT
• For Use With: KIT33887PNBEVB - KIT EVAL 33887 5A H-BRIDGE PQFNKIT33887DWBEVB - KIT EVAL 33887 5A H-BRIDGE SOIC
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Voltage - Load: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Device on Thermal Test Board
34
33887
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
Material:
Outline:
Area A:
Ambient Conditions:
AGND
PGND
PGND
OUT1
OUT1
IN1
FS
V+
V+
FB
12.2 mm x 6.9 mm Exposed Pad
33887 Pin Connections
1
2
3
4
5
6
7
8
9
10
16.0 mm x 11.0 mm Body
20-Pin HSOP-EP
Single layer printed circuit board
FR4, 1.6 mm thickness
Cu traces, 0.07 mm thickness
80 mm x 100 mm board area,
including edge connector for thermal
testing
Cu heat spreading areas on board
surface
Natural convection, still air
1.27 mm Pitch
Tab
Tab
20
19
18
17
16
15
14
13
12
11
EN
IN2
D1
C
V+
OUT2
OUT2
D2
PGND
PGND
Figure 26. Thermal Test Board
CP
Table 8.
ambient air.
reference location on the board surface near a center lead of the
package (see
Thermal Resistance
R
R
θ
θ
JA
JS
is the thermal resistance between die junction and
is the thermal resistance between die junction and the
R
R
θ
θ
JA
JS
Thermal Resistance Performance
Figure
A
26).
Analog Integrated Circuit Device Data
Area A (mm
300
600
300
600
0.0
0.0
Freescale Semiconductor
2
)
°C/W
7.0
6.0
52
36
32
10