PIP401,118 NXP Semiconductors, PIP401,118 Datasheet - Page 7

IC OR-ING INTEL SW D2PAK

PIP401,118

Manufacturer Part Number
PIP401,118
Description
IC OR-ING INTEL SW D2PAK
Manufacturer
NXP Semiconductors
Datasheet

Specifications of PIP401,118

Applications
CompactPCI™ High Reliability Power Supply Networks
Number Of Outputs
1
Internal Switch(s)
Yes
Delay Time - On
7µs
Delay Time - Off
200ns
Voltage - Supply
6.3 V ~ 20 V
Current - Supply
3mA
Operating Temperature
-40°C ~ 150°C
Mounting Type
Surface Mount
Package / Case
D²Pak, TO-263 (6 leads + tab)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Fet Type
-
Other names
568-2326-2
934057294118
PIP401 /T3
Philips Semiconductors
9. Thermal characteristics
Table 4:
9397 750 10578
Product data
Symbol
R
R
Fig 4. Transient thermal impedance from junction to mounting base as a function of pulse duration.
th(j-mb)
th(j-a)
Z th(j-mb)
(K/W)
10 -1
10 -2
10 -3
Thermal characteristics
1
Parameter
thermal resistance from
junction to mounting base
thermal resistance from
junction to ambient
10 -6
0.02
0.2
0.05
0.1
single pulse
= 0.5
9.1 Transient thermal impedance
10 -5
10 -4
Conditions
Figure 4
mounted on glass-epoxy
circuit board with 25 mm x
25 mm copper area under
mounting base, thermal vias
and forced air cooling;
airflow = 0.8 ms
(150 LFM).
mounted on glass-epoxy
circuit board with minimum
footprint area
Rev. 03 — 5 November 2002
10 -3
-1
10 -2
Min
-
-
-
10 -1
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.
Typ
0.5
15
50
OR-ing Intelligent Switch
P
t p
1
T
Max
0.65
-
-
=
PIP401
t p
T
t
t p (s)
03af37
10
Unit
K/W
K/W
K/W
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