MC10XS3435BPNA Freescale Semiconductor, MC10XS3435BPNA Datasheet - Page 48

• Manufacturer Part Number: MC10XS3435BPNA
• Description: IC SWITCH HIGH SIDE QUAD 24-QFN
• Manufacturer: Freescale Semiconductor
• Type: High Side Switchr

Specifications of MC10XS3435BPNA

• Number Of Outputs: 4
• Rds (on): 2 x 10 mOhm, 2 x 35 mOhm
• Internal Switch(s): Yes
• Current Limit: 5A
• Voltage - Input: 6 ~ 20 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 24-QFN
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Device on Thermal Test Board
48
10XS3435
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 1.0)
Material:
Outline:
Area A:
Ambient Conditions:
Figure 20. Steady State Thermal Resistance in Dependence on Heat Spreading Area;
65.00
60.00
55.00
50.00
45.00
40.00
35.00
30.00
25.00
Single layer printed circuit board
FR4, 1.6 mm thickness
Cu traces, 0.07 mm thickness
Cu buried traces thickness 0.035mm
76.2 mm x 114.3 mm board area,
including edge connector for thermal
testing, 74 mm x 74 mm buried
layers area
Cu heat-spreading areas on board
surface
Natural convection, still air
0
1s JEDEC Thermal Test Board with Spreading Areas
100
RJA11
Heat spreading area [sqmm]
200
RJA12=RJA21
Table 26. Thermal Resistance Performance
ambient air.
die that is heated. Index n refers to the number of the die
where the junction temperature is sensed.
300
Resistance
R
Thermal
R
This device is a dual die package. Index m indicates the
θ
JA mn
θJA
is the thermal resistance between die junction and
400
Area A
(mm
150
300
450
600
0
2
RJA22
)
Analog Integrated Circuit Device Data
1 = Power Chip, 2 = Logic Chip
m = 1,
47.77
42.90
40.95
39.85
38.96
500
n = 1
Freescale Semiconductor
m = 1, n = 2
m = 2, n = 1
600
36.90
33.21
31.78
30.89
30.21
m = 2,
54.35
51.07
49.63
48.61
47.90
n = 2
(°C/W)