LTC3108EGN-1#PBF Linear Technology, LTC3108EGN-1#PBF Datasheet - Page 22

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LTC3108EGN-1#PBF

Manufacturer Part Number
LTC3108EGN-1#PBF
Description
IC VOLTAGE CONVERTER 16-SSOP
Manufacturer
Linear Technology
Datasheet

Specifications of LTC3108EGN-1#PBF

Applications
Energy Harvesting
Current - Supply
3mA
Voltage - Supply
20mV ~ 500mV
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
16-SSOP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LTC3108EGN-1#PBFLTC3108EGN-1
Manufacturer:
LT
Quantity:
10 000
LTC3108-1
package DescripTion

3.60 0.05
TOP MARK
2.20 0.05
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
(NOTE 6)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
PIN 1
0.200 REF
NOTE:
1. DRAWING PROPOSED TO BE A VARIATION OF VERSION
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
ON THE TOP AND BOTTOM OF PACKAGE
(WGED) IN JEDEC PACKAGE OUTLINE M0-229
1.70 0.05
0.25 0.05
4.00 0.10
3.30 0.05
(2 SIDES)
2.50 REF
12-Lead Plastic DFN (4mm × 3mm)
0.50 BSC
(Reference LTC DWG # 05-08-1695)
0.70 0.05
0.75 0.05
3.00 0.10
(2 SIDES)
UE/DE Package
PACKAGE OUTLINE
0.00 – 0.05
R = 0.05
TYP
BOTTOM VIEW—EXPOSED PAD
1.70 0.10
0.25 0.05
6
7
R = 0.115
3.30 0.10
2.50 REF
TYP
0.50 BSC
12
1
0.40 0.10
PIN 1 NOTCH
R = 0.20 OR
0.35 45
CHAMFER
(UE12/DE12) DFN 0806 REV D
31081f

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