MAX17120ETJ+ Maxim Integrated Products, MAX17120ETJ+ Datasheet - Page 3

• Manufacturer Part Number: MAX17120ETJ+
• Description: IC DRVR SCAN TFT LDC 32-TQFN
• Manufacturer: Maxim Integrated Products

Specifications of MAX17120ETJ+

• Applications: LCD TV/Monitor
• Mounting Type: Surface Mount
• Package / Case: 32-TQFN Exposed Pad
• Maximum Operating Temperature: + 85 C
• Attached Touch Screen: No
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Supply: -
• Voltage - Supply: -
• Operating Temperature: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

II. Manufacturing Information
III. Packaging Information
IV. Die Information
Maxim Integrated Products. All rights reserved.
A. Description/Function:
B. Process:
C. Number of Device Transistors:
D. Fabrication Location:
E. Assembly Location:
F. Date of Initial Production:
A. Package Type:
B. Lead Frame:
C. Lead Finish:
D. Die Attach:
E. Bondwire:
F. Mold Material:
G. Assembly Diagram:
H. Flammability Rating:
I. Classification of Moisture Sensitivity per
JEDEC standard J-STD-020-C
J. Single Layer Theta Ja:
K. Single Layer Theta Jc:
L. Multi Layer Theta Ja:
M. Multi Layer Theta Jc:
A. Dimensions:
B. Passivation:
C. Interconnect:
D. Backside Metallization:
E. Minimum Metal Width:
F. Minimum Metal Spacing:
G. Bondpad Dimensions:
H. Isolation Dielectric:
I. Die Separation Method:
Triple High-Voltage Scan Driver for TFT LCD
S4
2800
California
Thailand
July 25, 2009
32-pin TQFN 5x5
Copper
100% matte Tin
Non-conductive
Au (1 mil dia.)
Epoxy with silica filler
#05-9000-3694
Class UL94-V0
Level 1
53.7°C/W
19.9°C/W
40.2°C/W
19.9°C/W
63 X 86 mils
Si
Al with Ti/TiN Barrier
None
Metal1 = 0.5 / Metal2 = 0.6 / Metal3 = 0.6 microns (as drawn)
Metal1 = 0.45 / Metal2 = 0.5 / Metal3 = 0.6 microns (as drawn)
5 mil. Sq.
SiO
Wafer Saw
3
N
2
4
/SiO
2
(Silicon nitride/ Silicon dioxide)
MAX17120ETJ+
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