MAX16065ETM+ Maxim Integrated Products, MAX16065ETM+ Datasheet - Page 51

IC SYSTEM MANAGER 12CH 48-TQFN

MAX16065ETM+

Manufacturer Part Number
MAX16065ETM+
Description
IC SYSTEM MANAGER 12CH 48-TQFN
Manufacturer
Maxim Integrated Products
Datasheet

Specifications of MAX16065ETM+

Applications
Power Supply Monitor, Sequencer
Voltage - Supply
2.8 V ~ 14 V
Current - Supply
4.5mA
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
48-TQFN Exposed Pad
Number Of Voltages Monitored
12
Undervoltage Threshold
2.7 V
Manual Reset
Resettable
Watchdog
Yes
Battery Backup Switching
No
Power-up Reset Delay (typ)
200 us
Supply Voltage (max)
14 V
Supply Voltage (min)
2.8 V
Supply Current (typ)
10 mA
Maximum Power Dissipation
2222 mW
Mounting Style
SMD/SMT
Maximum Operating Temperature
+ 85 C
Chip Enable Signals
No
Internal Hysteresis
Yes
Minimum Operating Temperature
- 40 C
Power Fail Detection
No
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Voltage - Input
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
required, t
culate the capacitor size:
C = (t
where the capacitance is in Farads and t
seconds, I
across the diode, and V
a V
of 153ms, the minimum required capacitance is 202FF.
Up to eight of the programmable outputs (EN_OUT1–
EN_OUT8) of the MAX16065/MAX16066 can be config-
ured as charge-pump outputs to drive the gates of series-
pass n-channel MOSFETs. When driving MOSFETs,
these outputs act as simple power switches to turn on
the voltage supply rails. Approximate the slew rate, SR,
using the following formula:
where I
C
is the capacitance connected from the gate to ground.
If more than eight series-pass MOSFETs are required
for an application, additional series-pass p-channel
MOSFETs can be connected to outputs configured as
Table 33. Maximum Write Time
Figure
12-Channel/8-Channel, Flash-Configurable System
GATE
IN
r6Dh[1:0]
VALUE
FAULT_SAVE
of 14V, a diode drop of 0.7V, and a t
17. Power Circuit for Shutdown During Fault Conditions
00
01
10
11
CP
is the gate capacitance of the MOSFET, and C
Driving High-Side MOSFET Switches
FAULT_SAVE
CC(MAX)
is the 4FA (typ) charge-pump source current,
V
IN
SR = I
Managers with Nonvolatile Fault Registers
Save flags and ADC
readings
Save flags
Save ADC readings
Do not save anything
______________________________________________________________________________________
x I
is 14mA, V
DESCRIPTION
CC(MAX)
C
CP
. Use the following formula to cal-
UVLO
/(C
GATE
V
CC
)/(V
is 2.7V. For example, with
DIODE
MAX16065
MAX16066
IN
+ C
GND
- V
EXT
is the voltage drop
DIODE
FAULT_SAVE
)
WRITE TIME
MAXIMUM
FAULT_SAVE
(ms)
244
153
- V
77
UVLO
is in
EXT
)
Figure
active-low open drain (Figure 18). Connect a pullup
resistor from the gate to the source of the MOSFET, and
ensure the absolute maximum ratings of the MAX16065/
MAX16066 are not exceeded.
An evaluation kit and a graphical user interface (GUI) is
available to create a custom configuration for the device.
Refer to the MAX16065/MAX16066 Evaluation Kit for
configuration.
Multiple MAX16065/MAX16066s can be cascaded to
increase the number of rails controlled for sequencing
and monitoring. There are many ways to cascade the
devices depending on the desired behavior. In general,
there are several techniques:
U Configure a GPIO_ on each device to be EXTFAULT
U Connect open-drain RESET outputs together to obtain
U Connect all EN inputs together for a master enable sig-
Cascading Multiple MAX16065/MAX16066s
(open drain). Externally wire them together with a
single pullup resistor. Set register bits r72h[5] and
r6Dh[2] to ‘1’ so that all faults will propagate between
devices. If a critical fault occurs on one device,
EXTFAULT will assert, triggering the nonvolatile fault
logger in all cascaded devices and recording a snap-
shot of all system voltages.
a master system reset signal.
nal. Since the internal timings of each cascaded device
are not synchronized, EN_OUT_s placed in the same
18. Connection for a p-Channel Series-Pass MOSFET
V
IN
MON_
R
MAX16065
MAX16066
Configuring the Device
EN_OUT_
V
OUT
51

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