SE95D,112 NXP Semiconductors, SE95D,112 Datasheet - Page 2
![IC SENSOR TEMP 2.8-5.5V SOT96-1](/photos/5/44/54425/568-8-soic_sot96-1_sml.jpg)
SE95D,112
Manufacturer Part Number
SE95D,112
Description
IC SENSOR TEMP 2.8-5.5V SOT96-1
Manufacturer
NXP Semiconductors
Datasheet
1.SE95DP118.pdf
(27 pages)
Specifications of SE95D,112
Function
Temp Sensor, Watchdog
Topology
ADC (Sigma Delta), Comparator, Register Bank
Sensor Type
Internal
Sensing Temperature
-55°C ~ 125°C
Output Type
I²C™
Output Alarm
No
Output Fan
Yes
Voltage - Supply
2.8 V ~ 5.5 V
Operating Temperature
-55°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
935274141112
SE95D
SE95D
SE95D
SE95D
NXP Semiconductors
2. Features
3. Applications
4. Ordering information
Table 1.
SE95_7
Product data sheet
Type
number
SE95D
SE95DP
SE95U
Ordering information
Package
Temperature range
55 C to +125 C
55 C to +125 C
55 C to +125 C
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
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Pin-for-pin replacement for industry standard LM75/LM75A
Specification of a single part over supply voltage from 2.8 V to 5.5 V
Small 8-pin package types: SO8 and TSSOP8 (MSOP8)
I
Supply voltage from 2.8 V to 5.5 V
Temperature range from 55 C to +125 C
13-bit ADC that offers a temperature resolution of 0.03125 C
Temperature accuracy of
Programmable temperature threshold and hysteresis set points
Supply current of 7.0 A in shutdown mode for power conservation
Stand-alone operation as thermostat at power-up
ESD protection exceeds 1000 V for Human Body Model (HBM) per JESD22-A114 and
150 V for Machine Model (MM) per JESD22-A115
Latch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA
System thermal management
Personal computers
Electronics equipment
Industrial controllers
2
C-bus interface to 400 kHz with up to 8 devices on the same bus
Name
SO8
TSSOP8
-
Ultra high accuracy digital temperature sensor and thermal watchdog
Rev. 07 — 2 September 2009
Description
plastic small outline package; 8 leads; body width 3.9 mm
plastic thin shrink small outline package; 8 leads;
body width 3 mm
wafer
1 C from 25 C to +100 C
© NXP B.V. 2009. All rights reserved.
Version
SOT96-1
SOT505-1
-
SE95
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