SE98ATP,147 NXP Semiconductors, SE98ATP,147 Datasheet - Page 2
![IC TEMPERATURE SENSOR DDR 8HWSON](/photos/7/49/74954/8-hwson_sot1069-1_sml.jpg)
SE98ATP,147
Manufacturer Part Number
SE98ATP,147
Description
IC TEMPERATURE SENSOR DDR 8HWSON
Manufacturer
NXP Semiconductors
Datasheet
1.SE98ATP547.pdf
(43 pages)
Specifications of SE98ATP,147
Function
Temp Monitoring System (Sensor)
Topology
ADC (Sigma Delta), Register Bank
Sensor Type
Internal
Sensing Temperature
-40°C ~ 125°C
Output Type
I²C™/SMBus™
Output Alarm
Yes
Output Fan
Yes
Voltage - Supply
1.7 V ~ 3.6 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
8-WSON
Full Temp Accuracy
+/- 2 C
Digital Output - Bus Interface
2-Wire
Digital Output - Number Of Bits
11
Supply Voltage (max)
3.6 V
Supply Voltage (min)
1.7 V
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 40 C
Supply Current
250 uA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
NXP Semiconductors
3. Applications
4. Ordering information
Table 1.
[1]
SE98A_4
Product data sheet
Type number
SE98APW
SE98ATP
SE98ATL
Industry standard 2 mm × 3 mm × 0.8 mm package to JEDEC VCED-3 PSON8 in 8 mm × 4 mm pitch tape 4 k quantity reels.
[1]
Ordering information
Topside
mark
S98A
98A
8AL
Operating current: 250 μA (typ.) and 400 μA (max.)
Programmable hysteresis threshold: 0 °C, 1.5 °C, 3 °C, 6 °C
Over/under/critical temperature EVENT output
B grade accuracy:
ESD protection exceeds 2000 V HBM per JESD22-A114, 250 V MM per
JESD22-A115, and 1000 V CDM per JESD22-C101
Latch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA
Available packages: TSSOP8, HWSON8 (PSON8 VCED-3) and HXSON8
DDR2 and DDR3 memory modules
Laptops, personal computers and servers
Enterprise networking
Hard disk drives and other PC peripherals
Package
Name
TSSOP8
HWSON8
HXSON8
±0.5 °C/±1 °C (typ./max.) → +75 °C to +95 °C
±1 °C/±2 °C (typ./max.) → +40 °C to +125 °C
±2 °C/±3 °C (typ./max.) → −40 °C to +125 °C
Description
plastic thin shrink small outline package; 8 leads;
body width 4.4 mm
plastic thermal enhanced very very thin small outline package;
no leads; 8 terminals; body 2 × 3 × 0.8 mm
plastic thermal enhanced extremely thin small outline package;
no leads; 8 terminals; body 2 × 3 × 0.5 mm
Rev. 04 — 25 November 2009
DDR memory module temp sensor, 1.7 V to 3.6 V
© NXP B.V. 2009. All rights reserved.
SE98A
Version
SOT530-1
SOT1069-2
SOT1052-1
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