TMP05AKS-REEL Analog Devices Inc, TMP05AKS-REEL Datasheet - Page 8

• Manufacturer Part Number: TMP05AKS-REEL
• Description: IC SENSOR TEMP PWM OUT SC70-5
• Manufacturer: Analog Devices Inc

Specifications of TMP05AKS-REEL

• Function: Temp Monitoring System (Sensor)
• Topology: ADC (Sigma Delta), Averaging Control
• Sensor Type: Internal
• Sensing Temperature: -40°C ~ 150°C
• Output Type: CMOS/TTL
• Output Alarm: No
• Output Fan: No
• Voltage - Supply: 3 V ~ 5.5 V
• Operating Temperature: -40°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: SC-70-5, SC-88A, SOT-323-5, SOT-353, 5-TSSOP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

TMP05/TMP06
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
V
Digital Input Voltage to GND
Maximum Output Current (OUT)
Operating Temperature Range
Storage Temperature Range
Maximum Junction Temperature, T
5-Lead SOT-23 (RJ-5)
5-Lead SC-70 (KS-5)
IR Reflow Soldering
IR Reflow Soldering (Pb-Free Package)
1
2
3
4
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
It is not recommended to operate the device at temperatures above 125°C
for more than a total of 5% (5,000 hours) of the lifetime of the device. Any
exposure beyond this limit affects device reliability.
SOT-23 values relate to the package being used on a 2-layer PCB and SC-70
values relate to the package being used on a 4-layer PCB. See Figure 4 for a
plot of maximum power dissipation vs. ambient temperature (T
T
Junction-to-case resistance is applicable to components featuring a
preferential flow direction, for example, components mounted on a heat
sink. Junction-to-ambient resistance is more useful for air-cooled PCB
mounted components.
DD
A
Power Dissipation
Thermal Impedance
Power Dissipation
Thermal Impedance
Peak Temperature
Time at Peak Temperature
Ramp-Up Rate
Ramp-Down Rate
Time 25°C to Peak Temperature
Peak Temperature
Time at Peak Temperature
Ramp-Up Rate
Ramp-Down Rate
Time 25°C to Peak Temperature
= ambient temperature.
to GND
θ
θ
θ
JA
JA
JC
, Junction-to-Ambient (Still Air)
, Junction-to-Ambient
, Junction-to-Case
2
2
4
4
1
J
max
Rating
–0.3 V to +7 V
–0.3 V to V
±10 mA
–40°C to +150°C
–65°C to +160°C
150°C
W
240°C/W
W
534.7°C/W
172.3°C/W
220°C (0°C/5°C)
10 sec to 20 sec
2°C/s to 3°C/s
−6°C/s
6 minutes max
260°C (0°C)
20 sec to 40 sec
3°C/sec max
–6°C/sec max
8 minutes max
MAX
MAX
= (T
= (T
J
J
max – T
max – T
DD
A
+ 0.3 V
).
A
A
3
3
)/θ
)/θ
Rev. B | Page 8 of 28
JA
JA
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Figure 4. Maximum Power Dissipation vs. Ambient Temperature
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
TEMPERATURE (°C)
SC-70
SOT-23