CKCM25X5R0J474M TDK Corporation, CKCM25X5R0J474M Datasheet - Page 16
![CAP 2-ARRAY .47UF 6.3V X5R 0504](/photos/0/92/9274/ckcm25x5r0j474m_sml.jpg)
CKCM25X5R0J474M
Manufacturer Part Number
CKCM25X5R0J474M
Description
CAP 2-ARRAY .47UF 6.3V X5R 0504
Manufacturer
TDK Corporation
Series
CKCr
Specifications of CKCM25X5R0J474M
Capacitance
0.47µF
Tolerance
±20%
Temperature Coefficient
X5R
Package / Case
0504 (1210 Metric)
Voltage - Rated
6.3V
Dielectric Material
Ceramic
Number Of Capacitors
2
Circuit Type
Isolated
Mounting Type
Surface Mount
Height
0.035" (0.90mm)
Size / Dimension
0.054" L x 0.039" W (1.37mm x 1.00mm)
Voltage Rating
6.3 Volts
Number Of Elements
2
Operating Temperature Range
- 55 C to + 85 C
Termination Style
SMD/SMT
Dimensions
1.37 mm L x 1 mm W x 2 mm H
Product
Ceramic Capacitor Arrays
Capacitance Tolerance
± 20%
No. Of Elements
2
Capacitor Mounting
SMD
Rohs Compliant
Yes
Dielectric Characteristic
X5R
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
445-1873-2
Reflow Soldering
Symbol
Excessive
solder
Adequate
solder
Insufficient
solder
• Recommended Soldering Land Pattern
• Recommended Solder Amount
• All specifications are subject to change without notice. Please read the precautions before using the product.
US Catalog // CKC Series — Array Type Capacitors // Version A11
P
A
B
C
Type
Soldering
Information
CKCM25 & CKCL22
CKCL44 & CKCA43
P
CKCM25
0.64
0.45
0.3
0.3
C
P
C
CKCL22
1.0
0.4
0.6
0.5
A
Maximum amount
Minimum amount
B
A
CKCL44
B
0.55
0.25
0.5
0.6
Higher tensile
force on the chip
capacitor may
cause cracking.
Small solder fillet
may cause
contact failure or
failure to hold the
chip capacitor to
the P.C. board.
CKCA43
0.6 ~ 0.7
0.8 ~ 1.0
Unit: mm
0.8
0.4
CKC Series — Array Type Capacitors
Peak
Temp
• Recommended Soldering Profile
0
Solder
Recommended soldering duration
Recommended solder compositions
Preheating Condition
Lead-Free Solder
Manual soldering
Reflow soldering
Over 60 sec.
Sn-37Pb (Sn-Pb solder)
Sn-3.0Ag-0.5Cu (Lead Free Solder)
Sn-Pb Solder
∆T
Soldering
Preheating
Method
Reflow Soldering
Temp./
Peak Temp time
Dura.
Soldering Natural
cooling
Peak temp
CKCM25, CLCL22, CKCL44
230 max.
260 max.
(°C)
Reflow Soldering
300
∆T ≤ 150
∆T ≤ 150
0
Temperature (ºC)
Duration
20 max.
10 max.
∆T
(sec.)
Manual soldering
Preheating
(Solder iron)
3sec. (As short as possible)
CKCA43
∆T ≤ 130
∆T ≤ 130