GNM314R71C683MA01L Murata Electronics North America, GNM314R71C683MA01L Datasheet - Page 148

CAP 4-ARRAY 68000PF 16V X7R 1206

GNM314R71C683MA01L

Manufacturer Part Number
GNM314R71C683MA01L
Description
CAP 4-ARRAY 68000PF 16V X7R 1206
Manufacturer
Murata Electronics North America
Series
GNMr
Datasheet

Specifications of GNM314R71C683MA01L

Capacitance
0.068µF
Voltage - Rated
16V
Dielectric Material
Ceramic
Number Of Capacitors
4
Circuit Type
Isolated
Temperature Coefficient
X7R
Tolerance
±20%
Mounting Type
Surface Mount
Package / Case
1206 (3216 Metric)
Height
0.031" (0.80mm)
Size / Dimension
0.126" L x 0.063" W (3.20mm x 1.60mm)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
490-3444-2
!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
2. Land Dimensions
Table 1 Flow Soldering Method
Table 2 Reflow Soldering Method
146
Notice
Notice
Part Number
Part Number
2-1. A chip capacitor can be cracked due to the stress of
Continued from the preceding page.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
PCB bending / etc if the land area is larger than
needed and has an excess amount of solder.
Please refer to the land dimensions in table 1 for flow
soldering, table 2 for reflow soldering, table 3 for
GNM & LLA, and table 4 for LLM.
Please confirm the suitable land dimension by
evaluating the actual SET / PCB.
GRM18
GQM18
GRM21
GQM21
GRM31
GRM02
GRM03
GRM15
GRM18
GQM18
GRM21
GQM21
GRM31
GRM32
GRM43
GRM55
GQM22
GJM03
GJM15
LLR18
LLL21
LLL31
LLL15
LLL18
LLL21
LLL31
Dimensions
Dimensions
Chip (LgW)
Chip (LgW)
2.0g1.25
1.25g2.0
2.0g1.25
1.25g2.0
0.4g0.2
1.6g0.8
3.2g1.6
1.6g3.2
0.6g0.3
1.0g0.5
1.6g0.8
3.2g1.6
3.2g2.5
4.5g3.2
5.7g5.0
0.5g1.0
0.8g1.6
1.6g3.2
3.2g2.5
0.16 to 0.2
0.15 to 0.2
0.6 to 1.0
1.0 to 1.2
2.2 to 2.6
0.4 to 0.7
0.6 to 1.0
0.2 to 0.3
0.3 to 0.5
0.6 to 0.8
1.0 to 1.2
2.2 to 2.4
2.0 to 2.4
3.0 to 3.5
4.0 to 4.6
0.2 to 0.3
0.4 to 0.6
0.6 to 0.8
2.2 to 2.5
a
a
0.12 to 0.18
0.35 to 0.45
0.2 to 0.35
0.2 to 0.25
c
0.8 to 0.9
0.9 to 1.0
1.0 to 1.1
0.5 to 0.7
0.8 to 0.9
0.6 to 0.7
0.6 to 0.7
0.8 to 0.9
1.0 to 1.2
1.2 to 1.4
1.4 to 1.6
0.3 to 0.4
0.4 to 0.5
0.6 to 0.7
0.8 to 1.0
b
Chip Capacitor
b
b
a
Continued on the following page.
Solder Resist
Land
0.2 to 0.23
0.6 to 0.8
0.8 to 1.1
1.0 to 1.4
1.4 to 1.8
2.6 to 2.8
0.2 to 0.4
0.4 to 0.6
0.6 to 0.8
0.8 to 1.1
1.0 to 1.4
1.8 to 2.3
2.3 to 3.0
3.5 to 4.8
0.7 to 1.0
1.4 to 1.6
1.4 to 1.8
2.6 to 2.8
1.9 to 2.3
c
c
(in mm)
(in mm)
C02E.pdf
10.12.20

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