ISL6845IB Intersil, ISL6845IB Datasheet - Page 2

• Manufacturer Part Number: ISL6845IB
• Description: IC CNTRLR PWM CURR-MODE 8-SOIC
• Manufacturer: Intersil

Specifications of ISL6845IB

• Pwm Type: Current Mode
• Number Of Outputs: 1
• Frequency - Max: 2MHz
• Duty Cycle: 50%
• Voltage - Supply: 9 V ~ 16 V
• Buck: Yes
• Boost: Yes
• Flyback: Yes
• Inverting: No
• Doubler: No
• Divider: No
• Cuk: No
• Isolated: Yes
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 8-SOIC (3.9mm Width)
• Frequency-max: 2MHz
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Ordering Information
ISL6840IB*
ISL6840IBZ* (Note)
ISL6840IRZ-T† (Note)
ISL6840IU*
ISL6840IUZ* (Note)
ISL6841IB*
ISL6841IBZ* (Note)
ISL6841IRZ-T† (Note)
ISL6841IU*
ISL6841IUZ* (Note)
ISL6842IB*
ISL6842IBZ* (Note)
ISL6842IRZ-T† (Note)
ISL6842IU*
ISL6842IUZ* (Note)
ISL6843IB*
ISL6843IBZ* (Note)
ISL6843IRZ-T† (Note)
ISL6843IU*
ISL6843IUZ* (Note)
ISL6844IB*
ISL6844IBZ* (Note)
ISL6844IRZ-T† (Note)
ISL6844IU*
ISL6844IUZ* (Note)
ISL6845IB*
ISL6845IBZ* (Note)
ISL6845IRZ-T† (Note)
ISL6845IU*
ISL6845IUZ* (Note)
*Add “-T” suffix for tape and reel. Please refer to TB347 for details on reel specifications.
†Contact Factory for Availability
NOTE: These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100%
matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations).
Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J
STD-020.
PART NUMBER
ISL6840, ISL6841, ISL6842, ISL6843, ISL6844, ISL6845
2
ISL 6840IB
6840 IBZ
40Z
6840
6840Z
ISL 6841IB
6841 IBZ
41Z
6841
6841Z
ISL 6842IB
6842 IBZ
42Z
6842
6842Z
ISL 6843IB
6843 IBZ
43Z
6843
6843Z
ISL 6844IB
6844 IBZ
44Z
6844
6844Z
ISL 6845IB
6845 IBZ
45Z
6845
6845Z
PART MARKING
TEMP RANGE
-40 to +105
-40 to +105
-40 to +105
-40 to +105
-40 to +105
-40 to +105
-40 to +105
-40 to +105
-40 to +105
-40 to +105
-40 to +105
-40 to +105
-40 to +105
-40 to +105
-40 to +105
-40 to +105
-40 to +105
-40 to +105
-40 to +105
-40 to +105
-40 to +105
-40 to +105
-40 to +105
-40 to +105
-40 to +105
-40 to +105
-40 to +105
-40 to +105
-40 to +105
-40 to +105
(°C)
8 Ld SOIC
8 Ld SOIC (Pb-free)
8 Ld 2x3 DFN (Pb-free)
8 Ld MSOP
8 Ld MSOP (Pb-free)
8 Ld SOIC
8 Ld SOIC (Pb-free)
8 Ld 2x3 DFN (Pb-free)
8 Ld MSOP
8 Ld MSOP (Pb-free)
8 Ld SOIC
8 Ld SOIC (Pb-free)
8 Ld 2x3 DFN (Pb-free)
8 Ld MSOP
8 Ld MSOP (Pb-free)
8 Ld SOIC
8 Ld SOIC (Pb-free)
8 Ld 2x3 DFN (Pb-free)
8 Ld MSOP
8 Ld MSOP (Pb-free)
8 Ld SOIC
8 Ld SOIC (Pb-free)
8 Ld 2x3 DFN (Pb-free)
8 Ld MSOP
8 Ld MSOP (Pb-free)
8 Ld SOIC
8 Ld SOIC (Pb-free)
8 Ld 2x3 DFN (Pb-free)
8 Ld MSOP
8 Ld MSOP (Pb-free)
PACKAGE
M8.15
M8.15
L8.2x3
M8.118
M8.118
M8.15
M8.15
L8.2x3
M8.118
M8.118
M8.15
M8.15
L8.2x3
M8.118
M8.118
M8.15
M8.15
L8.2x3
M8.118
M8.118
M8.15
M8.15
L8.2x3
M8.118
M8.118
M8.15
M8.15
L8.2x3
M8.118
M8.118
PKG. DWG. #
August 7, 2008
FN9124.10