ISL6334CCRZ Intersil, ISL6334CCRZ Datasheet - Page 25

IC CTRLR PWM SYNC BUCK 40-QFN

ISL6334CCRZ

Manufacturer Part Number
ISL6334CCRZ
Description
IC CTRLR PWM SYNC BUCK 40-QFN
Manufacturer
Intersil
Datasheet

Specifications of ISL6334CCRZ

Applications
Controller, Intel VR11.1
Voltage - Input
3 ~ 12 V
Number Of Outputs
1
Voltage - Output
0.5 ~ 1.6 V
Operating Temperature
0°C ~ 70°C
Mounting Type
Surface Mount
Package / Case
40-VFQFN, 40-VFQFPN
Rohs Compliant
YES
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Power Stages
The first step in designing a multiphase converter is to
determine the number of phases. This determination
depends heavily upon the cost analysis, which in turn
depends on system constraints that differ from one design to
the next. Principally, the designer will be concerned with
whether components can be mounted on both sides of the
circuit board; whether through-hole components are
permitted; and the total board space available for power
supply circuitry. Generally speaking, the most economical
solutions are those in which each phase handles between
15A and 25A. All surface-mount designs will tend toward the
lower end of this current range. If through-hole MOSFETs
and inductors can be used, higher per-phase currents are
possible. In cases where board space is the limiting
constraint, current can be pushed as high as 40A per phase,
but these designs require heat sinks and forced air to cool
the MOSFETs, inductors and heat-dissipating surfaces.
MOSFETs
The choice of MOSFETs depends on the current each
MOSFET will be required to conduct; the switching
frequency; the capability of the MOSFETs to dissipate heat;
and the availability and nature of heat sinking and air flow.
LOWER MOSFET POWER CALCULATION
The calculation for heat dissipated in the lower MOSFET is
simple, since virtually all of the heat loss in the lower
MOSFET is due to current conducted through the channel
resistance (r
continuous output current; I
current (see Equation 1); d is the duty cycle (V
L is the per-channel inductance.
An additional term can be added to the lower-MOSFET loss
equation to account for additional loss accrued during the
dead time when inductor current is flowing through the
lower-MOSFET body diode. This term is dependent on the
diode forward voltage at I
frequency, F
the beginning and the end of the lower-MOSFET conduction
interval respectively.
Thus the total maximum power dissipated in each lower
MOSFET is approximated by the summation of P
P
Upper MOSFET Power Calculation
In addition to r
MOSFET losses are due to currents conducted across the
input voltage (V
higher portion of the upper-MOSFET losses are dependent on
switching frequency, the power calculation is more complex.
P
P
LOW,2
LOW 1
LOW 2
,
,
.
=
=
r
V
DS ON
DS(ON)
sw
D ON
(
DS(ON)
(
; and the length of dead times, t
IN
)
) during switching. Since a substantially
)
F
). In Equation 23, I
sw
I
----- -
N
M
losses, a large portion of the upper-
2
I
----- -
N
M
(
M
1 d
+
, V
P-P
I
--------- -
25
P-P
D(ON)
2
)
is the peak-to-peak inductor
+
⎞ t
I
--------------------------------- -
L P-P
d1
,
; the switching
+
12
2
M
(
1 d
I
----- -
is the maximum
N
M
)
I
--------- -
P-P
2
OUT
d1
LOW,1
and t
t
/V
d2
ISL6334B, ISL6334C
IN
(EQ. 23)
(EQ. 24)
); and
d2
and
, at
Upper MOSFET losses can be divided into separate
components involving the upper-MOSFET switching times;
the lower-MOSFET body-diode reverse-recovery charge, Q
and the upper MOSFET r
When the upper MOSFET turns off, the lower MOSFET does
not conduct any portion of the inductor current until the
voltage at the phase node falls below ground. Once the
lower MOSFET begins conducting, the current in the upper
MOSFET falls to zero as the current in the lower MOSFET
ramps up to assume the full inductor current. In Equation 25,
the required time for this commutation is t
approximated associated power loss is P
At turn on, the upper MOSFET begins to conduct and this
transition occurs over a time t
approximate power loss is P
A third component involves the lower MOSFET’s reverse-
recovery charge, Q
commutated to the upper MOSFET before the
lower-MOSFET’s body diode can draw all of Q
through the upper MOSFET across VIN. The power dissipated
as a result is P
Finally, the resistive part of the upper MOSFET’s is given in
Equation 28 as P
The total power dissipated by the upper MOSFET at full load
can now be approximated as the summation of the results
from Equations 25, 26, and 27. Since the power equations
depend on MOSFET parameters, choosing the correct
MOSFETs can be an iterative process involving repetitive
solutions to the loss equations for different MOSFETs and
different switching frequencies, as shown in Equation 28.
Current Sensing Resistor
The resistors connected to the ISEN+ pins determine the
gains in the load-line regulation loop and the channel-current
balance loop as well as setting the overcurrent trip point.
Select values for these resistors by using Equation 29:
where R
pin, N is the active channel number, R
the current sense element, either the DCR of the inductor or
R
desired overcurrent trip point. Typically, I
P
P
P
P
R
UP 1 ,
UP 2 ,
UP 3 ,
UP 4 ,
SENSE
ISEN
=
=
V
r
V
DS ON
ISEN
V
depending on the sensing method, and I
IN
IN
-------------------------- -
105 10
IN
(
I
----- -
Q
N
I
----- -
R
N
M
M
×
is the sense resistor connected to the ISEN+
UP,3
rr
X
)
+
f
S
I
--------- -
I
--------- -
UP,4
P-P
P-P
I
----- -
6
N
2
2
M
rr
and is approximated in Equation 27:
. Since the inductor current has fully
I
------------- -
OCP
⎞ t
⎞ t
2
N
.
d
----
----
2
2
2
+
1
DS(ON)
I
--------- - d
P-P
12
f
f
S
S
2
UP,2
2
. In Equation 26, the
.
conduction loss.
X
is the resistance of
OCP
UP,1
1
and the
rr
.
, it is conducted
can be chosen
August 31, 2010
OCP
(EQ. 28)
(EQ. 25)
(EQ. 26)
(EQ. 27)
(EQ. 29)
FN6689.2
is the
rr
;

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