DC002-10 NVE, DC002-10 Datasheet
DC002-10
Specifications of DC002-10
Related parts for DC002-10
DC002-10 Summary of contents
Page 1
... In addition to GMR Sensor products, NVE has begun designing and manufacturing accessory products for our sensors. These products are designed to be used with NVE’s sensors some cases as stand- alone parts, to provide higher level signal processing capabilities coupled with the robust performance characteristics that NVE products are known for. DB-Series Power Switch ICs – ...
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... Usable with Magnetic, Inductive, and Photo Sensors Description: The DB001-00 signal processing IC is designed to take the digital input signal from NVE’s AD9xx GMR Switch and provide a high current switched output corresponding with the sensor input. The part functions as the “front end” complete sensor assembly and includes protection against short circuits and high voltage transients from capacitive and inductive loads ...
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... Ground Packages: Please see the package drawing section in the Appendix for dimensions of the MSOP8 package. Pin Configuration: VCC NVE ISC FFD Source Out Sink Out www.nve.com Peripheral Integrated Circuits 3.3 Volts Amplifier Thermal Shutdown Vreg In LED Ground - 63 - phone: 952-829-9217 fax: 952-829-9189 ...
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... Reverse Battery Protection Output Current Junction Temperature Range Storage Temperature Range Notes : This part has reverse battery protection to -36V 1. 2. Due to package size, MSOP8 package contains 3-letter code to designate part type. www.nve.com Peripheral Integrated Circuits Vreg Vreg Sink In ShortL LED VCC Ground Min ...
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... LED driver to indicate an “ON” condition. The DB002 is available in the SOIC8 package (p/n DB002-02), as well as in die form (p/n DB002-01 designed to work with NVE’s AD1xx GMR Switch products, or any other current sourcing or CMOS/TTL digital output sensor element such as an inductive sensor or a photo sensor. ...
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... Sink Out Source Out Ground Input Vreg DB002-02 VCC Sink Out Packages: Please see the package drawing section in the Appendix for dimensions of the SOIC8 package. www.nve.com Peripheral Integrated Circuits 5.0 Volts Amplifier Thermal Shutdown Short Circuit Detection Circuitry Ground Delay Source ...
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... A capacitor of at least 1nF value must be placed between the Delay pin and ground on the IC. 2. NVE recommends a bypass capacitor between VCC and Ground, 10nF or larger 3. In noisy environments a capacitor may be used on Vreg if necessary 100nF. Electrical characteristics (-40°C to +125°C, unless otherwise noted) ...
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... Specifications Electrical characteristics (-40°C to +175°C, unless otherwise noted) Parameter Input Voltage (DC001-10) Output Voltage (DC001-10) Input Voltage (DC002-10) Output Voltage (DC002-10) Output Current Bias Current at Zero Output Current Absolute maximum ratings* Parameter Input Voltage Reverse Battery Voltage ...
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... Please see the package drawing section in the Appendix for dimensions of the TDFN6 package. Pin Configuration Vreg (Out) DC001-10, No Connect DC002-10 VCC (In) Note: The die attach pad is exposed on the back of this package. NVE recommends that it be connected to the ground pin and the PCB for improved temperature performance. www.nve.com ...
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... Description: The DD-Series signal processing IC is designed to take an analog, sinusoidal input signal such as that provided by NVE’s ABL-Series sensors and convert two wire, current modulated digital output. Inputs as small peak-to-peak can be provided to the IC, along with large signal offsets. The DD001-12 part will provide a 50% duty cycle digital output signal. ...
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... The supply voltage must appear across the power and ground terminals of the part. Any additional voltage drop due to the presence of a series resistor is not included in this specification. 2. Input signal range can be adjusted by programming the amplifier gain to a specific value; contact NVE for details. 3. Supply currents can be factory programmed to different levels, for example 3 mA and 6 mA and 14 mA; contact NVE for details ...
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... The DD-Series parts are available in the TDFN SO8 package. Please see the package drawing section in this catalog for dimensions. Pin Configuration: TDFN-SO8 Package Test Vreg DD001-12 VCC Ground www.nve.com Peripheral Integrated Circuits Offset Detector EEPROM Gain Current Level Note: Bridge + and Bridge Test connected only to the sensor element outputs for ESD and loading reasons ...