EL5825IL-T13 Intersil, EL5825IL-T13 Datasheet - Page 5
![IC VREF GEN 8CH TFT-LCD 24-QFN](/photos/28/19/281931/24-vqfn_r_sml.jpg)
EL5825IL-T13
Manufacturer Part Number
EL5825IL-T13
Description
IC VREF GEN 8CH TFT-LCD 24-QFN
Manufacturer
Intersil
Datasheet
1.EL5825IR.pdf
(12 pages)
Specifications of EL5825IL-T13
Applications
Converter, TFT, LCD
Voltage - Input
4.5 ~ 16.5 V
Number Of Outputs
8
Voltage - Output
0.5 ~ 14.95 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
24-VQFN Exposed Pad, 24-HVQFN, 24-SQFN, 24-DHVQFN
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Typical Performance Curves
FIGURE 10. PACKAGE POWER DISSIPATION vs AMBIENT
FIGURE 8. PACKAGE POWER DISSIPATION vs AMBIENT
1.4
1.2
0.8
0.6
0.4
0.2
2.5
1.5
0.5
1
0
3
2
1
0
0
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
TEMPERATURE
0
TEMPERATURE
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD - QFN EXPOSED
DIEPAD SOLDERED TO PCB PER JESD51-5
2.703W
1.176W
25
25
AMBIENT TEMPERATURE (°C)
AMBIENT TEMPERATURE (°C)
50
50
FIGURE 7. SMALL SIGNAL RESPONSE (FALLING FROM 200mV TO 100mV)
5
75
85
75
100
85
100
(Continued)
125
OUTA
SCLK
SDA
ENA
M=200µs/div
125
150
EL5825
FIGURE 11. PACKAGE POWER DISSIPATION vs AMBIENT
FIGURE 9. PACKAGE POWER DISSIPATION vs AMBIENT
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0
0
JEDEC JESD51-3 LOW EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
TEMPERATURE
TEMPERATURE
0
JEDEC JESD51-3 AND SEMI G42-88 (SINGLE
LAYER) TEST BOARD
781mW
714mW
25
25
AMBIENT TEMPERATURE (°C)
AMBIENT TEMPERATURE (°C)
50
50
75
85
75
100
85
100
125
125
150
June 24, 2005
FN7005.4