AP6714M10G-13 Diodes Inc, AP6714M10G-13 Datasheet - Page 13

• Manufacturer Part Number: AP6714M10G-13
• Description: IC BOOST CONV SYNC 1.8MHZ 10MSOP
• Manufacturer: Diodes Inc
• Type: Step-Up (Boost)r

Specifications of AP6714M10G-13

• Internal Switch(s): Yes
• Synchronous Rectifier: Yes
• Number Of Outputs: 1
• Voltage - Output: 1.8 ~ 5.5 V
• Frequency - Switching: 1.8MHz
• Voltage - Input: 0.9 ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 10-MSOP, Micro10™, 10-uMAX, 10-uSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Output: -
• Power - Output: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: AP6714M10GDITR

Application Information
The high frequency operation of the AP6714 allows the use of small surface mount inductors. The minimum
inductance value is limited by the following constraints:
Where
f= Operating frequency (Hz)
I
V
V
A resistor is required to connect PGND pin and OCP pin to prevent an overload occurs at the output. The
output voltage will drop and duty cycle will be reduced if the OCP exceeds 0.16V. When R
maximum switching current to operate normally is 1.6A (0.16V/0.1Ω). However, the actual switching current is
related to duty ratio. By the way, larger R
voltage is smaller then regular case while an overload condition exists.
The maximum recommended junction temperature (T
10-pin MSOP10 package is R
assured to an ambient temperature T
More power can be dissipated if the maximum ambient temperature of the application is lower.
Good PC board layout is important to achieve optimal performance from AP6714. Poor design can cause
excessive conducted and/or radiated noise. Conductors carrying discontinuous currents and any high-current
path should be made as short and wide as possible. A separate low-noise ground plane contain-ing the
reference and signal grounds should connect to the power-ground plane at only one point to minimize the
effects of power-ground currents. Typically, the ground planes are best joined right at the IC. Keep the
voltage-feedback network very close to the IC, preferably within 0.2in (5mm) of the FB pin. Nodes with high
dV/dt (switching nodes) should be kept as small as possible and should be routed away from high-impedance
nodes such as FB.
AP6714 Rev. 4
L
P
SW(Ripple)
IN(MIN)
OUT(MAX)
D
>
(
MAX
V
Inductor Selection
Over Current Protection (OCP)
Thermal Information
Designing a PC Board
IN
= Minimum Input Voltage (V)
)
= Allowable Inductor Current Ripple (A)
(
= Maximum Output Voltage (V)
MIN
f
=
×
T
)
I
J
×
SW
(
MAX
(
V
(
R
Ripple
OUT
θ
)
JA
−
(
)
MAX
T
×
A
V
)
OUT
−
V
(
MAX
IN
(
θJA
MIN
)
= 161°C/W, if the Power PAD is soldered. Specified regulator operation is
)
)
H
A
(Continued)
Internal circuit of OCP function
of 45°C. Therefore, the maximum power dissipation is about 500mW.
OCP
www.diodes.com
is recommended when V
13 of 15
1.8MHz SYNCHRONOUS BOOST CONVERTER
J
) of AP6714 is 125°C. The thermal resistance of the
OUT
− V
IN
≤ 0.5V since the dropped output
©
FEBRUARY 2009
AP6714
OCP
Diodes Incorporated
is 0.1Ω, the