LT3505EMS8E#PBF Linear Technology, LT3505EMS8E#PBF Datasheet - Page 23

• Manufacturer Part Number: LT3505EMS8E#PBF
• Description: IC REG SW STP DWN 1.2A 8-MSOP
• Manufacturer: Linear Technology
• Type: Step-Down (Buck)r

Specifications of LT3505EMS8E#PBF

• Internal Switch(s): Yes
• Synchronous Rectifier: No
• Number Of Outputs: 1
• Voltage - Output: 0.78 ~ 33.8 V
• Current - Output: 1.2A
• Frequency - Switching: 200kHz ~ 3MHz
• Voltage - Input: 3.6 ~ 36 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 8-MSOP Exposed Pad, 8-HMSOP, 8-eMSOP
• Dc To Dc Converter Type: Step Down
• Pin Count: 8
• Input Voltage: 36V
• Output Voltage: 0.78 to 33.84V
• Switching Freq: 200 TO 3000KHz
• Output Current: 1.2A
• Package Type: MSOP EP
• Output Type: Adjustable
• Switching Regulator: Yes
• Line Regulation: 0.007%/V(Typ)
• Mounting: Surface Mount
• Input Voltage (min): 3.6V
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power - Output: -
• Lead Free Status / Rohs Status: Compliant

PACKAGE DESCRIPTION
3.5 ±0.05
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
OUTLINE M0-229 VARIATION OF (WEED-1)
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
2.15 ±0.05
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
(.0165 ± .0015)
GAUGE PLANE
0.42 ± 0.038
TYP
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65 ±0.05
RECOMMENDED SOLDER PAD LAYOUT
(.206)
(2 SIDES)
5.23
MIN
0.25 ± 0.05
0.254
(.010)
2.794 ± 0.102
(.110 ± .004)
DETAIL “A”
2.38 ±0.05
(2 SIDES)
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
0° – 6° TYP
0.50
BSC
(.0256)
2.083 ± 0.102
(.082 ± .004)
0.65
BSC
0.53 ± 0.152
(.021 ± .006)
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
ON TOP AND BOTTOM OF PACKAGE
0.675 ±0.05
PACKAGE
OUTLINE
0.889 ± 0.127
(.035 ± .005)
(.126 – .136)
3.20 – 3.45
8-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1662)
(Reference LTC DWG # 05-08-1698)
(.007)
0.18
TOP MARK
8-Lead Plastic MSOP
(NOTE 6)
MS8E Package
PIN 1
0.200 REF
DD Package
EXPOSED PAD OPTION
BOTTOM VIEW OF
1
8
DETAIL “A”
(.081 ± .004)
2.06 ± 0.102
1.83 ± 0.102
(.072 ± .004)
0.75 ±0.05
3.00 ±0.10
(4 SIDES)
SEATING
PLANE
0.00 – 0.05
(.193 ± .006)
(.118 ± .004)
4.90 ± 0.152
3.00 ± 0.102
(.009 – .015)
0.22 – 0.38
(NOTE 3)
TYP
1.65 ± 0.10
(2 SIDES)
(.043)
MAX
1.10
(.0256)
0.65
BSC
BOTTOM VIEW—EXPOSED PAD
0.25 ± 0.05
1
8
R = 0.115
7 6 5
2 3
TYP
4
5
2.38 ±0.10
(2 SIDES)
4
(.118 ± .004)
3.00 ± 0.102
(.0205)
(NOTE 4)
(.034)
LT3505
0.52
0.86
REF
REF
0.127 ± 0.076
(.005 ± .003)
8
1
0.50 BSC
MSOP (MS8E) 0603
0.38 ± 0.10
(DD) DFN 1203
23
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