NBSG16BAHTBG ON Semiconductor, NBSG16BAHTBG Datasheet - Page 2

IC RCVR/DVR RSECL SIGE 16FCBGA

NBSG16BAHTBG

Manufacturer Part Number
NBSG16BAHTBG
Description
IC RCVR/DVR RSECL SIGE 16FCBGA
Manufacturer
ON Semiconductor
Type
Transceiverr
Datasheet

Specifications of NBSG16BAHTBG

Applications
Instrumentation
Mounting Type
Surface Mount
Package / Case
16-FCBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
NBSG16BAHTBG
Manufacturer:
ON Semiconductor
Quantity:
10 000
Table 1. PIN DESCRIPTION
1. The NC pins are electrically connected to the die and MUST be left open.
2. All V
3. In the differential configuration when the input termination pins (VTD, VTD) are connected to a common termination voltage, and if no signal
A1,D1,A4,
B3,C3
A2,A3
BGA
bottom (see case drawing) must be attached to a heat−sinking conduit.
is applied then the device will be susceptible to self−oscillation.
N/A
C2
C1
D4
C4
D3
D2
B1
B2
B4
C
D
CC
A
B
Figure 1. BGA−16 Pinout (Top View)
Pin
and V
5,8,13,16
V
V
D
D
EE
EE
QFN
1
9,12
EE
6,7
10
14
15
11
1
2
3
4
pins must be externally connected to Power Supply to guarantee proper operation. The thermally exposed pad on package
VTD
VTD
V
NC
2
BB
Name
VTD
VTD
V
V
V
V
NC
EP
Q
Q
D
D
MM
CC
EE
BB
V
V
V
NC
MM
CC
CC
3
LVCMOS, LVDS,
LVCMOS, LVDS,
RSECL Output
RSECL Output
LVTTL Input
LVTTL Input
ECL, CML,
ECL, CML,
V
V
4
Q
Q
I/O
EE
EE
Internal 50 W Termination Pin. See Table 2.
Inverted Differential Input. Internal 75 kW to V
Noninverted differential input. Internal 75 kW to V
Internal 50 W Termination Pin. See Table 2.
Negative Supply Voltage
No Connect
Positive Supply Voltage
Noninverted Differential Output. Typically Terminated with 50 W to
V
Inverted Differential Output. Typically Terminated with 50 W to V
LVCMOS Reference Voltage Output. (V
ECL Reference Voltage Output
The Exposed Pad (EP) and the QFN−16 package bottom is thermally connected
to the die for improved heat transfer out of package. The exposed pad must be
attached to a heat−sinking conduit. The pad is not electrically connected to the
die but may be electrically and thermally connected to V
http://onsemi.com
TT
= V
CC
− 2 V
2
VTD
VTD
D
D
Figure 2. QFN−16 Pinout (Top View)
1
2
3
4
V
V
16
EE
EE
5
Description
V
15
NC
NBSG16
BB
6
CC
V
14
NC
7
MM
− V
EE
EE
V
V
13
and 36.5 kW to V
8
)/2
EE
EE
EE
EE
12
11
10
9
on the PC board.
V
Q
Q
V
Exposed Pad (EP)
CC
CC
TT
CC
= V
.
CC
− 2 V

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