MC44BS373CAEFR2 Freescale Semiconductor, MC44BS373CAEFR2 Datasheet - Page 41
MC44BS373CAEFR2
Manufacturer Part Number
MC44BS373CAEFR2
Description
IC AUD/VID PAL MODULATOR 16-SOIC
Manufacturer
Freescale Semiconductor
Datasheet
1.MC44BS373CAD.pdf
(52 pages)
Specifications of MC44BS373CAEFR2
Applications
*
Mounting Type
Surface Mount
Package / Case
16-SOIC (3.9mm Width)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
MC44BS373CAEFR2TR
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
20 Packaging Instructions
Tape and reel packaging is per 12MRH00360A issue Y with the following conditions applicable for dual
in-line SOP (SOIC) package and quad flat pack no lead square (QFN).
Component orientation: Arrange parts with the pin-1 side closest to the tape’s round sprocket holes on the
tape’s trailing edge.
Moisture sensitivity levels are as follows:
•
•
•
MC44BS373CAD,R2—Moisture sensitivity level 1, no dry pack required
MC44BS373CAFC,R2 lead free packages—Moisture sensitivity level 3, dry pack required
MC44BS373CAEF,R2 lead free packages—Moisture sensitivity level 3, dry pack required
Figure 25. Quad Flat Pack No Lead Square
Figure 24. Dual In-line SOP (SOIC)
MC44BS373CA Data Sheet
Packaging Instructions