BGF 110 E6327 Infineon Technologies, BGF 110 E6327 Datasheet - Page 7
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BGF 110 E6327
Manufacturer Part Number
BGF 110 E6327
Description
IC MEMORY CARD PROTECT S-WLP-24
Manufacturer
Infineon Technologies
Datasheet
1.BGF_110_E6327.pdf
(8 pages)
Specifications of BGF 110 E6327
Applications
*
Mounting Type
Surface Mount
Package / Case
24-WLP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
BGF110E6327XT
SP000210963
SP000210963
Figure 4
Package Outline
Figure 5
Data Sheet
Line capacitance versus bias voltage
Package WLP-24-2
Pin A1
Corner Index Area
1) Dimension is measured at the maximum solder ball diameter, parallel to primary datum C
2) Pin 1 corner identified by marking
3) Primary datum C and seating plane are defined by the spherical crowns of the balls
13.5
13.0
12.5
12.0
11.5
11.0
10.5
0
1
2)
2
24x
COPLANARITY
STANDOFF
0.08 C
0.2
Typical line capacitance C(U)
±0.05
3
C
0.6
±0.05
4
7
U [V]
0.1
0.25
5
C
±0.04
1)
6
E1
D1
C1
B1
A1
4 x 0.4 = 1.6
E2
D2
C2
B2
A2
24x
E3
D3
C3
A3
7
2
SD Card Interface ESD Protection
±0.05
ø0.05
E4
D4
C4
B4
A4
BGF110_Line_capacitance.vsd
0.4
E5
D5
C5
B5
A5
M
8
A B
B
9
GWLN1132
V2.2, 2007-07-04
A
10
BGF110