HCPL-053L-000E Avago Technologies US Inc., HCPL-053L-000E Datasheet - Page 5

• Manufacturer Part Number: HCPL-053L-000E
• Description: OPTOCOUPLER 1MBD 3.3V 8-SOIC
• Manufacturer: Avago Technologies US Inc.

Specifications of HCPL-053L-000E

• Input Type: DC
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Voltage - Isolation: 3750Vrms
• Number Of Channels: 2, Unidirectional
• Current - Output / Channel: 8mA
• Data Rate: 1Mbps
• Propagation Delay High - Low @ If: 350ns @ 16mA
• Current - Dc Forward (if): 25mA
• Output Type: Open Collector
• Mounting Type: Surface Mount
• Isolation Voltage: 3750 Vrms
• Maximum Continuous Output Current: 8 mA
• Maximum Forward Diode Current: 25 mA
• Output Device: Transistor With Base
• Configuration: 2 Channel
• Current Transfer Ratio: 50 %
• Maximum Baud Rate: 1 MBps
• Maximum Forward Diode Voltage: 1.7 V
• Maximum Reverse Diode Voltage: 5 V
• Maximum Input Diode Current: 50 mA
• Maximum Power Dissipation: 100 mW
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: 0 C
• Number Of Elements: 2
• Reverse Breakdown Voltage: 5V
• Forward Voltage: 1.7V
• Forward Current: 50mA
• Package Type: SOIC
• Collector Current (dc) (max): 8mA
• Power Dissipation: 100mW
• Pin Count: 8
• Mounting: Surface Mount
• Operating Temp Range: 0C to 85C
• Operating Temperature Classification: Commercial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 516-1632-5

Recommended Pb-Free IR Profile
Solder Reflow Temperature Profile
Regulatory Information
The devices contained in this data sheet have been ap-
proved by the following organizations:
UL
Approval under UL 1577, Component Recognition Pro-
gram, File E55361.
CSA
Approval
Notice #5, File CA 88324.
5
TEMPERATURE
ROOM
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
T
T
smax
smax
smin
300
200
100
25
T
T
p
L
0
under
= 200 °C, T
Note: Non-halide flux should be used.
Note: Non-halide flux should be used.
0
150 - 200 °C
217 °C
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
160°C
150°C
140°C
t 25 °C to PEAK
3 °C/SEC. MAX.
60 to 180 SEC.
smin
CSA
PREHEAT
RAMP-UP
= 150 °C
t
50
s
3°C + 1°C/–0.5°C
260 +0/-5 °C
Component
PREHEATING TIME
150°C, 90 + 30 SEC.
TIME
2.5°C ± 0.5°C/SEC.
100
TIME (SECONDS)
t
t
L
p
Acceptance
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
60 to 150 SEC.
TEMP.
PEAK
245°C
RAMP-DOWN
6 °C/SEC. MAX.
150
SEC.
SEC.
30
30
50 SEC.
SOLDERING
IEC/EN/DIN EN 60747-5-2
Approved under :
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884Teil 2):2003-01
200°C
TIME
200
PEAK
TEMP.
240°C
TIGHT
TYPICAL
LOOSE
TEMP.
PEAK
230°C
250