HCPL-2201-500E Avago Technologies US Inc., HCPL-2201-500E Datasheet - Page 6
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HCPL-2201-500E
Manufacturer Part Number
HCPL-2201-500E
Description
OPTOCOUPLER 1CH 5MBD 8-SMD
Manufacturer
Avago Technologies US Inc.
Datasheet
1.HCPL-0201-500E.pdf
(18 pages)
Specifications of HCPL-2201-500E
Voltage - Isolation
3750Vrms
Number Of Channels
1, Unidirectional
Current - Output / Channel
25mA
Data Rate
5MBd
Propagation Delay High - Low @ If
150ns @ 3mA
Current - Dc Forward (if)
10mA
Input Type
DC
Output Type
Push-Pull, Totem-Pole
Mounting Type
Surface Mount, Gull Wing
Package / Case
8-SMD Gull Wing
No. Of Channels
1
Optocoupler Output Type
Logic Gate
Input Current
5mA
Output Voltage
20V
Opto Case Style
SMD
No. Of Pins
8
Peak Reflow Compatible (260 C)
Yes
Isolation Voltage
3.75kV
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HCPL-2201-500E
Manufacturer:
AVAGO
Quantity:
10 000
8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW2201/11)
Solder Reflow Temperature Profile
6
TEMPERATURE
(0.071 ± 0.006)
1.80 ± 0.15
ROOM
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
300
200
100
0
0
NOTE: NON-HALIDE FLUX SHOULD BE USED.
1
8
PREHEATING RATE 3 °C + 1 °C/–0.5 °C/SEC.
REFLOW HEATING RATE 2.5 °C ± 0.5 °C/SEC.
160 °C
150 °C
140 °C
(0.442 ± 0.006)
11.23 ± 0.15
7
2
(0.100)
6
3
BSC
2.54
4
5
50
(0.061)
MAX.
1.55
3 °C + 1 °C/–0.5 °C
(0.354 ± 0.006)
(0.158)
9.00 ± 0.15
4.00
150 °C, 90 + 30 SEC.
PREHEATING TIME
MAX.
(0.030 ± 0.010)
0.75 ± 0.25
2.5 C ± 0.5 °C/SEC.
100
LAND PATTERN RECOMMENDATION
TIME (SECONDS)
(0.051)
1.3
(0.039 ± 0.006)
(0.484 ± 0.012)
245 °C
TEMP.
PEAK
1.00 ± 0.15
12.30 ± 0.30
(0.433)
11.00
150
MAX.
SEC.
30
SEC.
30
(0.09)
2.29
7
o
NOM.
50 SEC.
(0.534)
SOLDERING
13.56
(0.010
0.254
200 °C
TIME
200
- 0.0051
+ 0.003)
+ 0.076
- 0.002)
PEAK
TEMP.
240 °C
TIGHT
TYPICAL
LOOSE
230 °C
TEMP.
PEAK
250