HCPL-2201 Avago Technologies US Inc., HCPL-2201 Datasheet - Page 7
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HCPL-2201
Manufacturer Part Number
HCPL-2201
Description
OPTOCOUPLER LOGIC-OUT 5MBD 8-DIP
Manufacturer
Avago Technologies US Inc.
Datasheet
1.HCPL-0201-500E.pdf
(18 pages)
Specifications of HCPL-2201
Mounting Type
Through Hole
Voltage - Isolation
3750Vrms
Number Of Channels
1, Unidirectional
Current - Output / Channel
25mA
Data Rate
5MBd
Propagation Delay High - Low @ If
150ns @ 3mA
Current - Dc Forward (if)
10mA
Input Type
DC
Output Type
Push-Pull, Totem-Pole
Package / Case
8-DIP (0.300", 7.62mm)
No. Of Channels
1
Isolation Voltage
3.75kV
Optocoupler Output Type
Logic Gate
Input Current
5mA
Output Voltage
20V
Opto Case Style
DIP
No. Of Pins
8
Propagation Delay
0.3µs
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
516-1057-5
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HCPL-2201
Manufacturer:
AVAGO
Quantity:
7
Part Number:
HCPL-2201
Manufacturer:
AVAGO/安华高
Quantity:
20 000
Company:
Part Number:
HCPL-2201#300
Manufacturer:
AVAGO
Quantity:
3 000
Company:
Part Number:
HCPL-2201#500
Manufacturer:
AVAGO
Quantity:
3 000
Company:
Part Number:
HCPL-2201-000E
Manufacturer:
AVAGO
Quantity:
5 000
Part Number:
HCPL-2201-000E
Manufacturer:
AVAGO/安华高
Quantity:
20 000
Company:
Part Number:
HCPL-2201-060E
Manufacturer:
AVAGO
Quantity:
5 000
Recommended Pb-Free IR Profile
Regulatory Information
The HCPL-22XX/02XX and HCNW22XX have been approved by the following organizations:
UL
Recognized under UL 1577, Component Recognition
Program, File E55361.
CSA
Approved under CSA Component Acceptance Notice
#5, File CA 88324.
Insulation and Safety Related Specifications
8-pin DIP Package
Option 300 - surface mount classification is Class A in accordance with CECC 00802.
7
Parameter
Minimum External
Air Gap (External
Clearance)
Minimum External
Tracking (External
Creepage)
Minimum Internal
Plastic Gap
(Internal Clearance)
Minimum Internal
Tracking (Internal
Creepage)
Tracking Resistance
(Comparative
Tracking Index)
Isolation Group
T
T
smax
smin
25
T
T
p
L
217 °C
150 - 200 °C
t 25 °C to PEAK
60 to 180 SEC.
PREHEAT
3 °C/SEC. MAX.
t
s
Symbol
L(101)
L(102)
RAMP-UP
CTI
* 260 +0/-5 °C
TIME
8-Pin DIP
(300 Mil)
Value
0.08
200
7.1
7.4
NA
IIIa
t
t
L
p
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
15 SEC.
60 to 150 SEC.
Value
SO-8
0.08
200
NA
RAMP-DOWN
6 °C/SEC. MAX.
4.9
4.8
IIIa
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884 Teil 2):2003-01
(Option 060 and HCNW only)
Widebody
(400 Mil)
Value
10.0
200
9.6
1.0
4.0
IIIa
Volts
Units
mm
mm
mm
mm
NOTES:
THE TIME FROM 25 °C to PEAK
TEMPERATURE = 8 MINUTES MAX.
T
NOTE: NON-HALIDE FLUX SHOULD BE USED.
* RECOMMENDED PEAK TEMPERATURE
smax
FOR WIDEBODY 400mils PACKAGE IS 245 °C
= 200 °C, T
Conditions
Measured from input terminals
to output terminals, shortest
distance through air.
Measured from input terminals
to output terminals, shortest
distance path along body.
Through insulation distance,
conductor to conductor, usually
the direct distance between the
photoemitter and photodetector
inside the optocoupler cavity.
Measured from input terminals
to output terminals, along
internal cavity.
DIN IEC 112/VDE 0303 Part 1
Material Group
(DIN VDE 0110, 1/89, Table 1)
smin
= 150 °C