HCPL-J454#300 Avago Technologies US Inc., HCPL-J454#300 Datasheet - Page 7

• Manufacturer Part Number: HCPL-J454#300
• Description: OPTOCOUPLER 1MBD ALGAAS 8-SMD GW
• Manufacturer: Avago Technologies US Inc.

Specifications of HCPL-J454#300

• Input Type: DC
• Package / Case: 8-SMD Gull Wing
• Voltage - Isolation: 3750Vrms
• Number Of Channels: 1, Unidirectional
• Current - Output / Channel: 8mA
• Propagation Delay High - Low @ If: 200ns @ 16mA
• Current - Dc Forward (if): 25mA
• Output Type: Open Collector
• Mounting Type: Surface Mount, Gull Wing
• Isolation Voltage: 3750 Vrms
• Minimum Forward Diode Voltage: 1.45 V
• Output Device: Phototransistor
• Configuration: 1 Channel
• Current Transfer Ratio: 65 %
• Maximum Baud Rate: 1 MBps
• Maximum Forward Diode Voltage: 1.85 V
• Maximum Reverse Diode Voltage: 3 V
• Maximum Input Diode Current: 25 mA
• Maximum Power Dissipation: 100 mW
• Maximum Operating Temperature: + 100 C
• Minimum Operating Temperature: - 55 C
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Solder Refl ow Temperature Profi le
Recommended Pb-Free IR Profi le
7
TEMPERATURE
ROOM
T
T
smax
300
200
100
smin
25
T
T
0
p
L
0
NOTE: NON-HALIDE FLUX SHOULD BE USED.
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
NOTE: NON-HALIDE FLUX SHOULD BE USED.
* RECOMMENDED PEAK TEMPERATURE FOR WIDEBODY 400mils PACKAGE IS 245 °C
smax
217 °C
PREHEATING RATE 3 °C + 1 °C/–0.5 °C/SEC.
REFLOW HEATING RATE 2.5 °C ± 0.5 °C/SEC.
160 °C
150 °C
140 °C
150 - 200 °C
= 200 °C, T
t 25 °C to PEAK
60 to 180 SEC.
smin
PREHEAT
3 °C/SEC. MAX.
= 150 °C
t
s
50
RAMP-UP
* 260 +0/-5 °C
3 °C + 1 °C/–0.5 °C
150 °C, 90 + 30 SEC.
TIME
PREHEATING TIME
t
2.5 C ± 0.5 °C/SEC.
t
L
p
100
TIME (SECONDS)
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
15 SEC.
60 to 150 SEC.
RAMP-DOWN
6 °C/SEC. MAX.
245 °C
TEMP.
PEAK
150
SEC.
30
SEC.
30
50 SEC.
SOLDERING
200 °C
TIME
200
PEAK
TEMP.
240 °C
TIGHT
TYPICAL
LOOSE
230 °C
TEMP.
PEAK
250