HCNW3120 Avago Technologies US Inc., HCNW3120 Datasheet - Page 6

• Manufacturer Part Number: HCNW3120
• Description: OPTOCOUPLR IGBT DRV 2.5A 8DIP
• Manufacturer: Avago Technologies US Inc.

Specifications of HCNW3120

• Voltage - Isolation: 5000Vrms
• Number Of Channels: 1, Unidirectional
• Current - Output / Channel: 2.5A
• Propagation Delay High - Low @ If: 300ns @ 7mA ~ 16mA
• Current - Dc Forward (if): 25mA
• Input Type: DC
• Output Type: Gate Driver
• Mounting Type: Through Hole
• Package / Case: 8-DIP (0.400", 10.16mm)
• No. Of Channels: 1
• Isolation Voltage: 5kV
• Optocoupler Output Type: Gate Drive
• Input Current: 16mA
• Output Voltage: 30V
• Opto Case Style: DIP
• No. Of Pins: 8
• Propagation Delay Low-high: 0.5µs
• Common Mode Voltage Vcm: 1500V
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Other names: 516-1124-5

Solder Reflow Temperature Profile
Recommended Pb-Free IR Profile
TEMPERATURE
6
ROOM
T
T
300
200
100
smax
smin
25
T
T
0
p
L
0
NOTE: NON-HALIDE FLUX SHOULD BE USED.
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
NOTE: NON-HALIDE FLUX SHOULD BE USED.
* RECOMMENDED PEAK TEMPERATURE FOR WIDEBODY 400mils PACKAGE IS 245 °C
smax
217 °C
PREHEATING RATE 3 °C + 1 °C/–0.5 °C/SEC.
REFLOW HEATING RATE 2.5 °C ± 0.5 °C/SEC.
160 °C
150 °C
140 °C
150 - 200 °C
= 200 °C, T
t 25 °C to PEAK
60 to 180 SEC.
smin
PREHEAT
3 °C/SEC. MAX.
= 150 °C
t
s
50
RAMP-UP
3 °C + 1 °C/–0.5 °C
* 260 +0/-5 °C
150 °C, 90 + 30 SEC.
TIME
PREHEATING TIME
2.5 C ± 0.5 °C/SEC.
t
t
L
p
100
TIME (SECONDS)
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
15 SEC.
60 to 150 SEC.
RAMP-DOWN
6 °C/SEC. MAX.
245 °C
TEMP.
PEAK
150
SEC.
30
SEC.
30
50 SEC.
SOLDERING
200 °C
TIME
200
PEAK
TEMP.
240 °C
TIGHT
TYPICAL
LOOSE
230 °C
TEMP.
PEAK
250