ACSL-6410-50TE Avago Technologies US Inc., ACSL-6410-50TE Datasheet - Page 7

• Manufacturer Part Number: ACSL-6410-50TE
• Description: OPTOCOUPLER QUAD BIDIR 16-SOIC
• Manufacturer: Avago Technologies US Inc.

Specifications of ACSL-6410-50TE

• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• Voltage - Isolation: 2500Vrms
• Number Of Channels: 4, Unidirectional
• Current - Output / Channel: 50mA
• Data Rate: 15MBd
• Propagation Delay High - Low @ If: 44ns @ 8mA
• Current - Dc Forward (if): 15mA
• Input Type: DC
• Output Type: Open Collector
• Mounting Type: Surface Mount
• Maximum Fall Time: 0.012 us
• Minimum Forward Diode Voltage: 1.25 V
• Output Device: Logic Gate Photo IC
• Configuration: 4 Channel
• Maximum Baud Rate: 15 MBps
• Maximum Forward Diode Voltage: 1.8 V
• Maximum Reverse Diode Voltage: 5 V
• Maximum Power Dissipation: 40 mW
• Maximum Operating Temperature: + 100 C
• Minimum Operating Temperature: - 40 C
• Number Of Elements: 4
• Baud Rate: 15Mbps
• Forward Voltage: 1.8V
• Forward Current: 15mA
• Output Current: 50mA
• Isolation Voltage: 2500Vrms
• Package Type: SOIC N
• Operating Temp Range: -40C to 100C
• Power Dissipation: 65mW
• Propagation Delay Time: 100ns
• Pin Count: 16
• Mounting: Surface Mount
• Reverse Breakdown Voltage: 5V
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

Solder Reflow Temperature Profile
Note: Non-halide flux should be used
Recommended Pb-free IR Profile
7
Note: Non-halide flux should be used
TEMPERATURE
ROOM
300
200
100
0
0
PREHEATING RATE 3 ° C + 1 ° C/–0.5 ° C/SEC.
REFLOW HEATING RATE 2.5 ° C ± 0.5 ° C/SEC.
160 ° C
150 ° C °
140 C
50
3 ° C + 1 ° C/–0.5 ° C
PREHEATING TIME
150 C, 90 ± 30 SEC.
2.5 ° C ± 0.5 ° C/SEC.
100
TIME (SECONDS)
TEMP.
PEAK
245 ° C
150
SEC.
30
SEC.
30
50 SEC.
SOLDERING
200 ° C
TIME
200
PEAK
TEMP.
240 ° C
TIGHT
TYPICAL
LOOSE
TEMP.
PEAK
230 ° C
250