HCPL-5531#100 Avago Technologies US Inc., HCPL-5531#100 Datasheet - Page 2

• Manufacturer Part Number: HCPL-5531#100
• Description: ISOLAT 1.5KVDC 2CH OPEN 8SMD BJ
• Manufacturer: Avago Technologies US Inc.

Specifications of HCPL-5531#100

• Input Type: DC
• Package / Case: 8-SMD Butt Joint
• Voltage - Isolation: 1500VDC
• Number Of Channels: 2, Unidirectional
• Current - Output / Channel: 8mA
• Data Rate: 400kbps
• Propagation Delay High - Low @ If: 400ns @ 16mA
• Current - Dc Forward (if): 20mA
• Output Type: Open Collector
• Mounting Type: Surface Mount
• Output Device: Phototransistor
• Configuration: 2 Channel
• Current Transfer Ratio: 20 %
• Maximum Baud Rate: 400 KBps
• Maximum Forward Diode Voltage: 1.9 V
• Maximum Input Diode Current: 20 mA
• Maximum Power Dissipation: 200 mW
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 55 C
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Each channel contains a GaAsP light emitting diode which
is optically coupled to an integrated photon detector.
Separate connections for the photodiodes and output
transistor collectors improve the speed up to a hundred
times that of a conventional phototransistor optocoupler
by reducing the base-collector capacitance.
These devices are suitable for wide bandwidth analog
applications, as well as for interfacing TTL to LSTTL or
CMOS. Current Transfer Ratio (CTR) is 9% minimum at I
= 16 mA. The 18 V V
to interface any TTL family to CMOS. The availability of
the base lead allows optimized gain/ bandwidth adjust-
ment in analog applications. The shallow depth of the
IC photodiode provides better radiation immunity than
conventional phototransistor couplers.
These products are also available with the transistor base
node not connected to improve common mode noise
immunity and ESD susceptibility. In addition, higher CTR
minimums are available by special request.
Package styles for these parts are 8 and 16 pin DIP through
hole (case outlines P and E respectively), 16 pin DIP flat
pack (case outline F), and leadless ceramic chip carrier
(case outline 2). Devices may be purchased with a variety
of lead bend and plating options, see Selection Guide Table
for details. Standard Microcircuit Drawing (SMD) parts are
available for each package and lead style.
Because the same functional die (emitters and detectors)
are used for each channel of each device listed in this
data sheet, absolute maximum ratings, recommended
operating conditions, electrical specifications, and perfor-
mance characteristics shown in the figures are identical
for all parts. Occasional exceptions exist due to package
variations and limitations and are as noted. Additionally,
the same package assembly processes and materials are
used in all devices. These similarities give justification for
the use of data obtained from one part to represent other
part’s performance for die related reliability and certain
limited radiation test results.

CC
capability will enable the designer
F
Truth Table
(Positive Logic)
Functional Diagram
Multiple Channel Devices Available
On (H)
Off (L)
Input
GND
V
Output
V
CC
V
B
O
H
L