HCPL-5631#200 Avago Technologies US Inc., HCPL-5631#200 Datasheet - Page 11

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HCPL-5631#200

Manufacturer Part Number
HCPL-5631#200
Description
OPTOCOUPLER LOGIC OUT 8-DIP
Manufacturer
Avago Technologies US Inc.
Datasheet

Specifications of HCPL-5631#200

Package / Case
8-DIP (0.300", 7.62mm)
Voltage - Isolation
1500VDC
Number Of Channels
2, Unidirectional
Current - Output / Channel
25mA
Data Rate
10Mbps
Propagation Delay High - Low @ If
55ns @ 13mA
Current - Dc Forward (if)
20mA
Input Type
DC
Output Type
Open Collector
Mounting Type
Through Hole
Maximum Continuous Output Current
25 mA
Maximum Fall Time
40 ns
Maximum Forward Diode Current
20 mA
Maximum Rise Time
90 ns
Output Device
Logic Gate Photo IC
Configuration
2 Channel
Maximum Baud Rate
10 MBps
Maximum Forward Diode Voltage
1.9 V
Maximum Reverse Diode Voltage
5 V
Maximum Power Dissipation
200 mW
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 55 C
Number Of Elements
2
Baud Rate
10Mbps
Forward Voltage
1.9V
Forward Current
20mA
Output Current
25mA
Package Type
PDIP
Operating Temp Range
-55C to 125C
Fall Time
40ns
Rise Time
90ns
Power Dissipation
200mW
Propagation Delay Time
140ns
Pin Count
8
Mounting
Through Hole
Reverse Breakdown Voltage
5V
Operating Temperature Classification
Military
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Contains lead / RoHS non-compliant

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Part Number:
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Manufacturer:
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Quantity:
436
Figure 8. Test Circuit for t
Figure 10. Operating Circuit for Burn-In and Steady State Life Tests.
11
GENERATOR
Z
I
CONDITIONS: I
T
* ALL CHANNELS TESTED SIMULTANEOUSLY.
t
F
PULSE
O
r
A
= 13 mA
= 5 ns
= 50 Ω
= +125
V
IN
+
(EACH INPUT)
(EACH OUTPUT)
* C
STRAY WIRING CAPACITANCE.
5.3 V
o
-
L
C
INCLUDES PROBE AND
I
F
O
= 20 mA
= 25 mA
200 Ω
EHL
D.U.T.
and t
V
ELH
GND
V
OUT
CC
V
.
E
D.U.T.*
GND
V
0.01 µF
BYPASS
CC
OUTPUT V
MONITORING
NODE
(EACH OUTPUT)
0.01 µF
+5.5 V
V
CC
+5 V
R
E
200 Ω
C
L
L
*
+5.5 V
OUTPUT V
MONITORING
NODE
V
OC
O
Figure 9. Enable Propagation Delay vs. Temperature.

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