HCPL-5430#300 Avago Technologies US Inc., HCPL-5430#300 Datasheet - Page 3

• Manufacturer Part Number: HCPL-5430#300
• Description: OPTOCOUPLER 2CH 40MBS 8-SMD GW
• Manufacturer: Avago Technologies US Inc.

Specifications of HCPL-5430#300

• Package / Case: 8-SMD Gull Wing
• Voltage - Isolation: 1500VDC
• Number Of Channels: 1, Unidirectional
• Current - Output / Channel: 25mA
• Data Rate: 40Mbps
• Propagation Delay High - Low @ If: 33ns @ 10mA
• Current - Dc Forward (if): 10mA
• Input Type: DC
• Output Type: Push-Pull, Totem-Pole
• Mounting Type: Surface Mount, Gull Wing
• Maximum Continuous Output Current: 25 mA
• Maximum Fall Time: 10 ns
• Maximum Forward Diode Current: 10 mA
• Maximum Rise Time: 15 ns
• Minimum Forward Diode Voltage: 1 V
• Output Device: Logic Gate Photo IC
• Configuration: 2 Channel
• Maximum Baud Rate: 40 MBps
• Maximum Forward Diode Voltage: 1.85 V
• Maximum Reverse Diode Voltage: 3 V
• Maximum Power Dissipation: 200 mW
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 55 C
• Number Of Elements: 2
• Baud Rate: 40Mbps
• Forward Voltage: 1.85V
• Forward Current: 10mA
• Output Current: 25mA
• Package Type: PDIP SMD
• Operating Temp Range: -55C to 125C
• Power Dissipation: 200mW
• Propagation Delay Time: 60ns
• Pin Count: 8
• Mounting: Surface Mount
• Reverse Breakdown Voltage: 3V
• Operating Temperature Classification: Military
• Lead Free Status / RoHS Status: Lead free by exemption / RoHS compliant by exemption
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free by exemption / RoHS compliant by exemption

;; ; ; ;; ; ;
8.70 (0.342)
9.10 (0.358)
0.51 (0.020)
Functional Diagrams
Note: All DIP devices have common V
ground connections.
Outline Drawings
20 Terminal LCCC Surface Mount, 2 Channels
8 Pin DIP Through Hole, 1 and 2 Channel
3
2.29 (0.090)
2.79 (0.110)
MIN.
1.78 (0.070)
2.03 (0.080)
4.95 (0.195)
5.21 (0.205)
1.78 (0.070)
2.03 (0.080)
1.52 (0.060)
2.03 (0.080)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
SOLDER THICKNESS 0.127 (0.005) MAX.
1
2
3
4
8 Pin DIP
Through Hole
1 Channel
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
0.76 (0.030)
1.27 (0.050)
9.40 (0.370)
9.91 (0.390)
8.70 (0.342)
9.10 (0.358)
4.95 (0.195)
5.21 (0.205)
0.64
(0.025)
(20 PLCS)
GND
V
CC
V
V
E
O
0.51 (0.020)
8
7
6
5
3.81 (0.150)
MAX.
CC
1.02 (0.040) (3 PLCS)
TERMINAL 1 IDENTIFIER
2.16 (0.085)
METALLIZED
CASTILLATIONS (20 PLCS)
0.51 (0.020)
1.14 (0.045)
1.40 (0.055)
4.32 (0.170)
MIN.
and ground. LCCC (leadless ceramic chip carrier) package has isolated channels with separate V
MAX.
1
2
3
4
8 Pin DIP
Through Hole
2 Channels
8.13 (0.320)
7.16 (0.282)
7.57 (0.298)
7.36 (0.290)
7.87 (0.310)
0.20 (0.008)
0.33 (0.013)
MAX.
GND
V
V
V
CC
O1
O2
8
7
6
5
19
20
20 Pad LCCC
Surface Mount
2 Channels
2
3
GND
V
1
CC2
15
V
V
7
O2
O1
GND
8
V
CC1
2
13
12
10
CC
and