PC910L0NSZ0F Sharp Microelectronics, PC910L0NSZ0F Datasheet

PHOTOCOUPLER OPIC 8-DIP

PC910L0NSZ0F

Manufacturer Part Number
PC910L0NSZ0F
Description
PHOTOCOUPLER OPIC 8-DIP
Manufacturer
Sharp Microelectronics
Series
OPIC™r
Datasheet

Specifications of PC910L0NSZ0F

Voltage - Isolation
5000Vrms
Number Of Channels
1, Unidirectional
Current - Output / Channel
10mA
Data Rate
25Mbps
Propagation Delay High - Low @ If
23ns
Input Type
Logic
Output Type
Push-Pull, Totem-Pole
Mounting Type
Through Hole
Package / Case
8-DIP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
425-2207-5
■ Description
■ Features
PC912L0NSZ0F
Series
coupled to an OPIC chip.
ing lead-form option.
t r a n s f e r r a t e i s M A X . 2 5 M b / s a n d C M R i s M I N .
20 kV/µs.
1. DIP 8 pin package
2. Double transfer mold package
3. High speed response
4. High noise immunity due to high instantaneous com-
5. High isolation voltage between input and output
6. Lead-free and RoHS directive compliant
∗ "OPIC"(Optical IC) is a trademark of the SHARP Corporation. An OPIC consists of a light-detecting element and a signal-processing
circuit integrated onto a single chip.
Notice The content of data sheet is subject to change without prior notice.
PC912L0NSZ0F Series contains a LED optically
It is packaged in a 8 pin DIP, available in SMT gullw-
Input-output isolation voltage(rms) is 5.0 kV. Data
(Ideal for Flow Soldering)
(t
mon mode rejection voltage
(CM
(V
PHL
iso(rms)
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
H
: MAX. 40ns, t
: MIN. 20 kV/µs, CM
: 5.0 kV)
PLH
: MAX. 40ns)
L
: MIN. −20 kV/µs)
1
■ Agency approvals/Compliance
■ Applications
High Speed 25Mb/s, High CMR type
DIP 8 pin ∗ OPIC Photocoupler
1. Recognized by UL1577 (Double protection isolation),
2. Approved by VDE (DIN EN60747-5-2
3. Package resin : UL flammability grade (94V-0)
1. FA equipment
file No. E64380 (as model No. PC912L)
tion), file No. 40008898 (as model No. PC912L)
(∗)
DIN EN60747-5-2 : successor standard of DIN VDE0884
PC912L0NSZ0F Series
Sheet No.: D2-A05803EN
© SHARP Corporation
(∗)
Date Sep. 1. 2006
) (as an op-

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PC910L0NSZ0F Summary of contents

Page 1

PC912L0NSZ0F Series ■ Description PC912L0NSZ0F Series contains a LED optically coupled to an OPIC chip packaged pin DIP, available in SMT gullw- ing lead-form option. Input-output isolation voltage(rms) is 5.0 kV. Data ...

Page 2

Internal Connection Diagram ■ Truth table Input LED Output OFF H ■ Outline Dimensions 1. Through-Hole [ex. PC912L0NSZ0F] ±0.3 1.2 ±0.20 0.85 SHARP mark "S" ...

Page 3

SMT Gullwing Lead-Form [ex. PC912L0NIZ0F] ±0.3 1.2 ±0.20 0.85 SHARP mark "S" Date code ±0.50 9.66 Primary side mark ±0.25 +0.4 1.0 2.54 −0.0 Product ...

Page 4

Date code (2 digit) 1st digit Year of production A.D. Mark A.D Mark 1990 A 2002 P 1991 B 2003 R 1992 C 2004 S 1993 D 2005 T 1994 E 2006 U 1995 F 2007 V 1996 H 2008 ...

Page 5

Absolute Maximum Ratings (Unless otherwise specified T Parameter Symbol Supply voltage V CC1 Input Input voltage V IN Supply voltage V CC2 Output High level output voltage V O Low level output current Isolation voltage V ...

Page 6

Model Line-up Lead Form Through-Hole Sleeve Package 50pcs/sleeve DIN EN60747-5-2 −−−−−− Model No. PC912L0NSZ0F PC912L0YSZ0F Please contact a local SHARP sales representative to inquire about production status. SMT Gullwing Sleeve 50pcs/sleeve Approved −−−−−− Approved PC912L0NIZ0F PC912L0YIZ0F PC912L0NUZ0F PC912L0YUZ0F 6 ...

Page 7

Fig.1 Test Circuit for Propagation Delay Time and Rise Time, Fall Time 1 0.1µF 2 0→ < 1ns Pulse width 40ns Duty 50% 4 Fig.2 Test Circuit for Instantaneous Common Mode Rejection Voltage 1 ...

Page 8

Fig.5 Input High Level Supply Current vs. Ambient Temperature 3.0 2.5 2.0 1.5 1.0 0.5 0.0 −40 − Ambient temperature T Fig.7 Output High Level Supply Current vs. Ambient Temperature 5.0 4.0 3.0 2.0 1.0 0.0 −40 −20 ...

Page 9

Fig.11 Rise Time/Fall Time vs. Ambient Temperature −40 − Ambient temperature T Fig.13 Pulse Width Distortion vs. Ambient Temperature −1 −2 −40 − Ambient temperature T ...

Page 10

Design Considerations ● Recommended operating conditions Parameter Symbol Supply voltage V Supply voltage V Low level input voltage V V High level input voltage Operating temperature T ● Notes about static electricity Transistor of detector side in CMOS configuration ...

Page 11

Recommended Foot Print (reference) SMT Gullwing Lead-form Wide SMT Gullwing Lead-form ✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes. 8.2 2.2 10.2 2.2 11 PC912L0NSZ0F Series (Unit : mm) (Unit : mm) Sheet No.: D2-A05803EN ...

Page 12

Manufacturing Guidelines ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. (˚C) 300 Terminal : 260˚C peak ...

Page 13

Cleaning instructions Solvent cleaning: Solvent temperature should be 45˚C or below Immersion time should be 3minutes or less Ultrasonic cleaning: The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size ...

Page 14

Package specification ● Sleeve package 1. Through-Hole or SMT Gullwing Package materials Sleeve : HIPS (with anti-static material) Stopper : Styrene-Elastomer Package method MAX. 50 pcs. of products shall be packaged in a sleeve. Both ends shall be closed ...

Page 15

Important Notices · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for ...

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