TLP2200 Toshiba, TLP2200 Datasheet - Page 21
![PHOTOCOUPLER LOGIC OUT 8-DIP](/photos/7/66/76652/264-8-dip_sml.jpg)
TLP2200
Manufacturer Part Number
TLP2200
Description
PHOTOCOUPLER LOGIC OUT 8-DIP
Manufacturer
Toshiba
Specifications of TLP2200
Voltage - Isolation
2500Vrms
Number Of Channels
1, Unidirectional
Current - Output / Channel
25mA
Data Rate
2.5MBd
Propagation Delay High - Low @ If
250ns @ 1.6mA ~ 5mA
Current - Dc Forward (if)
10mA
Input Type
DC
Output Type
Tri-State
Mounting Type
Through Hole
Package / Case
8-DIP (0.300", 7.62mm)
No. Of Channels
1
Isolation Voltage
2.5kV
Optocoupler Output Type
Schmitt Trigger
Input Current
5mA
Output Voltage
20V
Opto Case Style
DIP
No. Of Pins
8
Approval Bodies
UL
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
TLP2200
Manufacturer:
TOS
Quantity:
5 510
Company:
Part Number:
TLP2200
Manufacturer:
TOS
Quantity:
5 510
Part Number:
TLP2200
Manufacturer:
TOSHBIA
Quantity:
20 000
Company:
Part Number:
TLP2200F
Manufacturer:
MICRON
Quantity:
101
Photocouplers for Logic Signal Transmission at 5 Mbit/s (Typ.) (Continued)
Photocouplers for Logic Signal Transmission at 1 Mbit/s (Typ.)
Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages.
Note 2: BSI and IEC: : Approved (supplementary or basic insulation)
TLP2105
TLP2108
TLP2200
TLP109
TLP2409
TLP512
TLP550
TLP551
TLP2403
TLP553
TLP559
TLP651
TLP719
TLP719F
Part Number
Part Number
Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details.
TÜV and VDE: : Approved
For the latest information, please contact your nearest Toshiba sales representative.
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
EN 60747-5-2-approved with option V4 or D4
Pin Configuration
Pin Configuration
8
1
8
1
8
1
8
1
8
1
8
1
8
1
8
1
8
1
8
1
6
1
6
1
6
1
7
2
7
2
7
2
7
2
7
2
7
2
7
2
7
2
7
2
7
2
5
5
2
5
2
6
3
6
3
6
3
6
3
6
3
6
3
6
3
6
3
6
3
6
3
: Design which meets safety standard/approval pending as of January 2011
4
3
3
4
4
3
5
4
5
4
5
4
5
4
5
4
5
4
5
4
5
4
5
4
5
4
SO6 (reinforced insulation)
SO8
Topr = 125˚C(max)
SO8 version of the TLP109
DIP6
6-pin package version
of the TLP550
DIP8
High CMR
DIP8
Internal base connection
SO8
Low input current
SO8 version of the TLP553
DIP8
Low input drive current
DIP8
High CMR version
of the TLP550
DIP8
Internal base connection
SDIP6
High CMR
SO8
Dual-channel version for
the TLP105
V
SO8
Dual-channel version for
the TLP108
V
DIP8
Low input current
V
CC
CC
CC
= 4.5 to 20 V
= 4.5 to 20 V
= 4.5 to 20 V
Features
Features
: Approved (reinforced insulation)
(NRZ) (Typ.)
Propagation
Delay Time
Data Rate
300 kbit/s
300 kbit/s
1 Mbit/s
1 Mbit/s
1 Mbit/s
1 Mbit/s
1 Mbit/s
1 Mbit/s
1 Mbit/s
1 Mbit/s
250 ns
250 ns
400 ns
(Max)
21
(19% min for rank 0)
(19% min for rank 0)
(19% min for rank 0)
(Inverter logic)
(Buffer logic)
(Buffer logic)
Output Form
Totem pole
Totem pole
400%
400%
20% (min)
20%
20%
20%
10%
10%
10%
20%
3-state
output
output
CTR
: Design which meets safety standard/approval pending as of January 2011
(min)
(min)
(min)
(min)
(min)
(min)
(min)
(min)
(min)
1.6 mA
1.6 mA
1.6 mA
0.5 mA
16 mA
16 mA
0.5 mA
16 mA
16 mA
16 mA
16 mA
16 mA
16 mA
(Max)
I
I
@I
FHL
FLH
F
,
Vrms
Vrms
Vrms
Vrms
Vrms
3750
3750
2500
3750
Vrms
3750
2500
Vrms
2500
Vrms
2500
Vrms
3750
2500
Vrms
2500
Vrms
5000
Vrms
5000
Vrms
BVs
BVs
UL/cUL TÜV
UL/cUL TÜV
/
/
/
/
/
/
/
/
/
/
/ –
/
/ –
Safety Standards
Safety Standards
VDE
VDE
(1)
(1)
(1)
(1)
(1)
BSI
BSI
(2)
(2)
IEC
IEC