TLP558 Toshiba, TLP558 Datasheet - Page 56

PHOTOCPLR TRANS INVERTER 8-DIP

TLP558

Manufacturer Part Number
TLP558
Description
PHOTOCPLR TRANS INVERTER 8-DIP
Manufacturer
Toshiba
Datasheets

Specifications of TLP558

Voltage - Isolation
2500Vrms
Number Of Channels
1, Unidirectional
Current - Output / Channel
40mA
Propagation Delay High - Low @ If
270ns @ 0 ~ 3mA
Current - Dc Forward (if)
10mA
Input Type
DC
Output Type
Push-Pull, Totem-Pole
Mounting Type
Through Hole
Package / Case
8-DIP (0.300", 7.62mm)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant

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8
Below are the example land patterns for surface-mount packages.
Surface-Mount Lead-Formed Photocouplers
Mini-flat and SOP couplers
Example:
1
MFSOP6 (4-Pin) [e.g., TLP181]
(LF1)&(LF5) [e.g., TLP734(LF1)]
SO6 (4-Pin) [e.g., TLP265J]
2.54SOP4 [e.g., TLP197G]
Board Assembly
For the example land patterns for the TLP781, see its datasheet.
Example Land Patterns
1.5
6-pin DIP package
0.8
2.54
2.54
2.54
SO8 [e.g., TLP2105]
1.27
1.27
MFSOP6 (5-Pin) [e.g., TLP114A]
(LF4) [e.g., TLP734(LF4)]
1.5
1.27
0.8
2.54
0.8
1.27
2.54
1.27
2.54
Unit: mm
56
SOP4 [e.g., TLP280]
Example:
0.8
1.27
SDIP6 [e.g., TLP719]
6-pin SDIP package
0.8
1.27 1.27
SO6 (5-Pin) [e.g., TLP109]
1.27
2.54
SSOP4 [e.g., TLP3213]
1.27
SDIP6 (F type) [e.g., TLP719F]
0.8
3.73
0.8
1.27 1.27
0.95
Unit: mm
Unit: mm

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