HCPL-2602 Avago Technologies US Inc., HCPL-2602 Datasheet - Page 5

• Manufacturer Part Number: HCPL-2602
• Description: OPTOCOUPLER LOG-OUT 1CHAN 8-DIP
• Manufacturer: Avago Technologies US Inc.
• Type: Line Receiverr

Specifications of HCPL-2602

• Mounting Type: Through Hole
• Voltage - Isolation: 3750Vrms
• Input Type: AC, DC
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 8-DIP (0.300", 7.62mm)
• No. Of Channels: 1
• Isolation Voltage: 3.75kV
• Optocoupler Output Type: Logic Gate
• Input Current: 60mA
• Output Voltage: 5.5V
• Opto Case Style: DIP
• No. Of Pins: 8
• Propagation Delay: 50ns
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Other names: 516-1146-5

Solder Reflow Thermal Profile
TEMPERATURE
Recommended Pb-Free IR Profile
Insulation and Safety Related Specifications
Option 300 - surface mount classification is Class A in accordance with CECC 00802.
5
Parameter
Min. External Air Gap
(External Clearance)
Min. External Tracking
Path (External Creepage)
Min. Internal Plastic
Gap (Internal Clearance)
Tracking Resistance
(Comparative Tracking
Index)
Isolation Group
ROOM
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
T
T
smax
smax
smin
300
200
100
T
T
25
p
L
0
= 200 °C, T
0
Note: Non-halide flux should be used.
150 - 200 °C
Note: Non-halide flux should be used.
217 °C
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
160°C
150°C
140°C
t 25 °C to PEAK
3 °C/SEC. MAX.
60 to 180 SEC.
smin
PREHEAT
RAMP-UP
= 150 °C
50
t
s
3°C + 1°C/–0.5°C
260 +0/-5 °C
150°C, 90 + 30 SEC.
PREHEATING TIME
Symbol
TIME
L(I01)
L(I02)
CTI
2.5°C ± 0.5°C/SEC.
100
TIME (SECONDS)
t
t
L
p
Value
0.08
200
IIIa
7.1
7.4
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
60 to 150 SEC.
TEMP.
PEAK
245°C
RAMP-DOWN
6 °C/SEC. MAX.
150
Units
mm
mm
mm
V
SEC.
SEC.
30
30
50 SEC.
Conditions
Measured from input terminals to output terminals,
shortest distance through air.
Measured from input terminals to output terminals,
shortest distance path along body.
Through insulation distance, conductor to conductor,
usually the direct distance between the photoemitter
and photodetector inside the optocoupler cavity.
DIN IEC 112/VDE 0303 Part 1
Material Group (DIN VDE 0110, 1/89, Table 1)
SOLDERING
200°C
TIME
200
PEAK
TEMP.
240°C
TIGHT
TYPICAL
LOOSE
TEMP.
PEAK
230°C
250
Regulatory Information
The HCPL-2602/2612 have been
approved by the following
organizations:
UL
Recognized under UL 1577,
Component Recognition Program,
File E55361.
CSA
Approved under CSA Component
Acceptance Notice #5, File CA
88324.