FOD852S Fairchild Optoelectronics Group, FOD852S Datasheet
FOD852S
Specifications of FOD852S
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FOD852S Summary of contents
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FOD852 4-Pin High Operating Temperature Photodarlington Optocoupler Features Applicable to Pb-free IR reflow soldering Compact 4-pin package High current transfer ratio: 1000% minimum C-UL, UL, and VDE approved High input-output isolation voltage of 5000Vrms High operating temperature of 100°C Applications ...
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Absolute Maximum Ratings Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure ...
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Electrical Characteristics Individual Component Characteristics Symbol Parameter INPUT V Forward Voltage F I Reverse Current R C Terminal Capacitance t OUTPUT I Collector Dark Current CEO BV Collector-Emitter Breakdown Voltage CEO BV Emitter-Collector Breakdown Voltage ECO Transfer Characteristics Symbol DC ...
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Typical Electrical/Optical Characteristic Curves Fig. 1 Forward Current vs. Ambient Temperature - AMBIENT TEMPERATURE Fig. 3 Collector-Emitted Saturation Voltage vs. Forward Current ...
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Typical Electrical/Optical Characteristic Curves Fig. 7. Relative Current Transfer Ratio vs. Ambient Temperature 1.0 0.8 0.6 0.4 0 AMBIENT TEMPERATURE Fig. 9 Collector Dark Current vs. Ambient Temperature 1000 ...
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Package Dimensions Through Hole 0.200 (5.10) 0.161 (4.10) 0.157 (4.00) 0.118 (3.00) 0.130 (3.30) 0.020 (0.51) 0.091 (2.30) TYP 0.150 (3.80) 0.110 (2.80) 0.024 (0.60) 0.016 (0.40) 0.110 (2.79) 0.090 (2.29) 0.4" Lead Spacing 0.200 (5.10) 0.157 (4.00) 0.161 (4.10) ...
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Ordering Information Option Order Entry Identifi 300 300W 3S 3SD Marking Information Definitions ©2006 Fairchild Semiconductor Corporation FOD852 Rev. 1.2.1 .S .SD .W .300 .300W VDE Approved, 0.4" Lead Spacing .3S ...
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Carrier Tape Specifications Ø1.55 0.05 Note: All dimensions are in millimeters. Symbol W Tape wide P Pitch of sprocket holes 0 F Distance of compartment Distance of compartment to compartment 1 A0 Compartment B0 K0 ©2006 Fairchild ...
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Lead Free Recommended IR Reflow Condition Tp Tsmax Tsmin 25 C Profile Feature Preheat condition (Tsmin-Tsmax / ts) Melt soldering zone Peak temperature (Tp) Ramp-down rate Recommended Wave Soldering condition Profile Feature Peak temperature (Tp) ©2006 Fairchild Semiconductor Corporation FOD852 ...
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TRADEMARKS The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not intended exhaustive list of all such trademarks. Build it Now™ FRFET CorePLUS™ Global Power Resource ...