HCPL-M454-000E Avago Technologies US Inc., HCPL-M454-000E Datasheet - Page 3

OPTOCOUPLER 1MBS TTL/IPM SO-5

HCPL-M454-000E

Manufacturer Part Number
HCPL-M454-000E
Description
OPTOCOUPLER 1MBS TTL/IPM SO-5
Manufacturer
Avago Technologies US Inc.
Datasheet

Specifications of HCPL-M454-000E

Number Of Channels
1
Input Type
DC
Voltage - Isolation
3750Vrms
Current Transfer Ratio (min)
25% @ 16mA
Current Transfer Ratio (max)
60% @ 16mA
Voltage - Output
20V
Current - Output / Channel
8mA
Current - Dc Forward (if)
25mA
Output Type
Transistor with Vcc
Mounting Type
Surface Mount
Package / Case
5-SOP
No. Of Channels
1
Optocoupler Output Type
Phototransistor
Input Current
16mA
Output Voltage
20V
Opto Case Style
SOIC
No. Of Pins
5
Input Current Max
50mA
Isolation Voltage
3.75kV
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Vce Saturation (max)
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HCPL-M454-000E
Manufacturer:
AVAGO/安华高
Quantity:
20 000
Absolute Maximum Ratings
(No Derating Required up to 85°C)
Storage Temperature .............................................................................-55°C to +125°C
Operating Temperature ........................................................................-55°C to +100°C
Average Input Current - I
Peak Input Current - I
Peak Transient Input Current - I
Reverse Input Voltage - V
Input Power Dissipation ......................................................................................45 mW
Average Output Current - I
Peak Output Current .................................................................................................16 mA
Output Voltage - V
Supply Voltage - V
Output Power Dissipation ............................................................................... 100 mW
Infrared and Vapor Phase Reflow Temperature ....................................... see below
TEMPERATURE
Solder Reflow Thermal Profile
ROOM
300
200
100
0
0
Note: Non-halide flux should be used.
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
160°C
150°C
140°C
CC
O
(Pin 5-4) .....................................................................-0.5 V to 20 V
(Pin 6-4) ....................................................................-0.5 V to 30 V
F
........................................................................................50 mA
F
R
50
(Pin 3-1) .............................................................................5 V
O
.................................................................................25 mA
3°C + 1°C/–0.5°C
(Pin 5) ....................................................................... 8 mA
PREHEATING TIME
150°C, 90 + 30 SEC.
F
............................................................................1.0 A
2.5°C ± 0.5°C/SEC.
100
TIME (SECONDS)
(50% duty cycle, 1 ms pulse width)
TEMP.
245°C
PEAK
(≤1 µs pulse width, 300 pps)
150
SEC.
SEC.
30
30
50 SEC.
SOLDERING
200°C
TIME
200
PEAK
TEMP.
240°C
TIGHT
TYPICAL
LOOSE
TEMP.
PEAK
230°C
[1]
[2]
[3]
[4]
250

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