SDCFJ-1024-388 SanDisk, SDCFJ-1024-388 Datasheet - Page 4

• Manufacturer Part Number: SDCFJ-1024-388
• Description: COMPACT FLASH 1GB
• Manufacturer: SanDisk
• Type: CompactFlashr

Specifications of SDCFJ-1024-388

• Memory Size: 1GB
• Memory Type: CompactFLASH
• Density: 1GByte
• Operating Supply Voltage (typ): 3.3/5V
• Operating Temperature (min): 0C
• Operating Temperature (max): 70C
• Package Type: Not Required
• Mounting: Socket
• Pin Count: 50
• Operating Temperature Classification: Commercial
• Operating Supply Voltage (min): 3.135/4.5V
• Operating Supply Voltage (max): 3.465/5.5V
• Programmable: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Table of Contents
1. Introduction to the CompactFlash Memory Card ............................................................................................... 1-1
2. Product Specifications ........................................................................................................................................ 2-1
3. CompactFlash Memory Card Interface Description ........................................................................................... 3-1
CompactFlash
1.1. Scope ................................................................................................................................................. 1-1
1.2. System Features................................................................................................................................. 1-2
1.3. PCMCIA Standard ............................................................................................................................ 1-2
1.4. CompactFlash Specification.............................................................................................................. 1-3
1.5. Related Documentation ..................................................................................................................... 1-3
1.6. Functional Description ...................................................................................................................... 1-3
2.1. System Environmental Specifications ............................................................................................... 2-1
2.2. System Power Requirements............................................................................................................. 2-1
2.3. System Performance.......................................................................................................................... 2-2
2.4. System Reliability ............................................................................................................................. 2-2
2.5. Physical Specifications...................................................................................................................... 2-2
2.6. Capacity Specifications ..................................................................................................................... 2-3
3.1. Physical Description.......................................................................................................................... 3-1
3.2. Electrical Description ........................................................................................................................ 3-3
3.3. Electrical Specification...................................................................................................................... 3-6
3.4. Card Configuration............................................................................................................................ 3-20
3.5. I/O Transfer Function........................................................................................................................ 3-24
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1.6.1. Technology Independence....................................................................................................... 1-4
1.6.2. Defect and Error Management ................................................................................................ 1-4
1.6.3. Wear Leveling......................................................................................................................... 1-4
1.6.4. Using the Erase Sector and Write without Erase Commands.................................................. 1-4
1.6.5. Automatic Sleep Mode............................................................................................................ 1-5
1.6.6. Dynamic Adjustment of Performance versus Power Consumption ........................................ 1-5
1.6.7. Power Supply Requirements ................................................................................................... 1-5
3.1.1. Pin Assignments and Pin Type................................................................................................ 3-1
3.3.1. Input Leakage Control............................................................................................................. 3-7
3.3.2. Input Characteristics................................................................................................................ 3-7
3.3.3. Output Drive Type .................................................................................................................. 3-7
3.3.4. Output Drive Characteristics ................................................................................................... 3-8
3.3.5. Power-up/Power-down Timing ............................................................................................... 3-8
3.3.6. Common Memory Read Timing ............................................................................................. 3-10
3.3.7. Common and Attribute Memory Write Timing ...................................................................... 3-11
3.3.8. Attribute Memory Read Timing Specification........................................................................ 3-12
3.3.9. Memory Timing Diagrams...................................................................................................... 3-12
3.3.10. I/O Read (Input) Timing Specification.................................................................................. 3-14
3.3.11. I/O Write (Output) Timing Specification .............................................................................. 3-16
3.3.12. True IDE Mode ..................................................................................................................... 3-17
3.4.1. Attribute Memory Function..................................................................................................... 3-21
3.4.2. Configuration Option Register (Address 200h in Attribute Memory) .................................... 3-22
3.4.3. Card Configuration and Status Register (Address 202h in Attribute Memory) ...................... 3-23
3.4.4. Pin Replacement Register (Address 204h in Attribute Memory)............................................ 3-23
3.4.5. Socket and Copy Register (Address 206h in Attribute Memory ............................................. 3-24
3.5.1. I/O Function ............................................................................................................................ 3-25
Memory Card Product Manual, Rev. 11.0 ©2006 SanDisk Corporation
3.3.12.1. Deskewing............................................................................................................ 3-17
3.3.12.2. Transfer Timing ................................................................................................... 3-17
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