MT16LSDT6464AG-133D2 Micron Technology Inc, MT16LSDT6464AG-133D2 Datasheet
MT16LSDT6464AG-133D2
Specifications of MT16LSDT6464AG-133D2
Related parts for MT16LSDT6464AG-133D2
MT16LSDT6464AG-133D2 Summary of contents
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... PRODUCTS AND SPECIFICATIONS DISCUSSED HEREIN ARE SUBJECT TO CHANGE BY MICRON WITHOUT NOTICE. 128MB (x64, SR), 256MB (x64, DR) MT8LSDT1664A – 128MB MT16LSDT3264A – 256MB For the latest data sheet, please refer to the Micron site: www.micron.com/products/modules Figure 1: 168-Pin DIMM (MO-161) Standard 1.375in. (34.93mm) Low Profile 1.125in. (28.58mm) Options • Package ...
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Table 3: Part Numbers PART NUMBER MT8LSDT1664AG-13E_ MT8LSDT1664AY-13E_ MT8LSDT1664AG-133_ MT8LSDT1664AY-133_ MT8LSDT1664AG-10E_ MT8LSDT1664AY-10E_ MT16LSDT3264AG-13E_ MT16LSDT3264AY-13E_ MT16LSDT3264AG-133_ MT16LSDT3264AY-133_ MT16LSDT3264AG-10E_ MT16LSDT3264AY-10E_ NOTE: The designators for component and PCB revision are the last two characters of each part number Consult factory for cur- rent ...
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Table 4: Pin Assignment (168-Pin DIMM Front) PIN SYMBOL PIN SYMBOL PIN SYMBOL PIN SYMBOL DQ0 DQ1 DQ2 DQ3 26 ...
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... BA0: SDRAMs BA0 BA1: SDRAMs BA1 NOTE: 1. All resistor values are 10Ω unless otherwise specified. 2. Per industry standard, Micron modules utilize various component speed grades, as referenced in the module part numbering guide at www.micron.com/numberguide. 09005aef80bccbe7 SD8_16C16_32x64AG.fm - Rev. E 12/05 EN 128MB (x64, SR), 256MB (x64, DR) ...
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... DD V SDRAMs U1-U4; U6-U9; U11-U14; U16-U19 SS NOTE: 1. All resistor values are 10Ω unless otherwise specified. 2. Per industry standard, Micron modules utilize various component speed grades, as referenced in the module part numbering guide at www.micron.com/numberguide. 09005aef80bccbe7 SD8_16C16_32x64AG.fm - Rev. E 12/05 EN 128MB (x64, SR), 256MB (x64, DR) ...
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Table 6: Pin Descriptions Pin numbers may not correlate with symbols; refer to Pin Assignment tables on page 3 for more information PIN NUMBERS SYMBOL 27, 115, 111 RAS#, CAS#, WE# 42, 79, 125, 163 CK0–CK3 63, 128 CKE0, CKE1 ...
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Table 6: Pin Descriptions Pin numbers may not correlate with symbols; refer to Pin Assignment tables on page 3 for more information PIN NUMBERS SYMBOL 1, 12, 23, 32, 43, V Supply SS 54, 64, 68, 78, 85, 96, 107, ...
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... General Description The MT8LSDT1664A and MT16LSDT3264A are high-speed CMOS, dynamic random-access, 128MB and 256MB memory modules organized in a x64 con- figuration. These modules use internally configured quad-bank SDRAMs with a synchronous interface (all signals are registered on the positive edge of the clock signals CK). ...
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Mode register bits M0–M2 specify the burst length, M3 specifies the type of burst (sequential or inter- leaved), M4–M6 specify the CAS latency, M7 and M8 specify the operating mode, M9 specifies the write burst mode, and M10 and M11 ...
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Table 7: Burst Definition ORDER OF ACCESSES WITHIN A BURST ADDRESS BURST STARTING TYPE = LENGTH COLUMN SEQUENTIAL 0 0-1-2 1-2-3 2-3-0 3-0-1-2 A2 ...
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Test modes and reserved states should not be used because unknown operation or incompatibility with future versions may result. Write Burst Mode When the burst length programmed via M0- M2 applies to both read and write bursts; ...
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Commands Table 9, SDRAM Commands and DQMB Operation Truth Table provides a quick reference of available commands. This is followed by a written description of Table 9: SDRAM Commands and DQMB Operation Truth Table CKE is HIGH for all commands ...
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Absolute Maximum Ratings Stresses greater than those listed may cause perma- nent damage to the device. This is a stress rating only, and functional operation of the device at these or any other conditions above those indicated in the opera- ...
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Table 12: I Specifications and Conditions – 128MB DD Notes 11, 13; notes appear on page 18; V PARAMETER/CONDITION OPERATING CURRENT: Active Mode Burst = 2; READ or WRITE (MIN) STANDBY CURRENT: ...
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Table 14: Capacitance – 128MB PARAMETER Input Capacitance: Command and Address Input Capacitance: CK Input Capacitance: S# Input Capacitance: CKE Input Capacitance: DQMB Input/Output Capacitance: DQ Table 15: Capacitance – 256MB PARAMETER Input Capacitance: Command and Address Input Capacitance: CK ...
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Table 16: Electrical Characteristics and Recommended AC Operating Conditions Notes: 5–9, 11, 32; notes appear on page 18; module AC timing parameters comply with PC100 and PC133 design specs, based on component parameters AC CHARACTERISTICS PARAMETER Access time from CLK ...
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Table 17: AC Functional Characteristics (Notes 11, 32; notes appear following parameter tables) PARAMETER READ/WRITE command to READ/WRITE command CKE to clock disable or power-down entry mode CKE to clock enable or power-down exit setup ...
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Notes 1. All voltages referenced to Vss. 2. This parameter is sampled MHz 25°C; pin under test biased at 1.4V. 3. Idd is dependent on output loading and cycle rates. Specified values are obtained ...
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SPD Clock and Data Conventions Data states on the SDA line can change only during SCL LOW. SDA state changes during SCL HIGH are reserved for indicating start and stop conditions (as shown in Figure 7, Data Validity, and Figure ...
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Table 18: EEPROM Device Select Code Most significant bit (b7) is sent first SELECT CODE Memory Area Select Code (two arrays) Protection Register Select Code Table 19: EEPROM Operating Modes MODE RW BIT Current Address Read 1 Random Address Read ...
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Table 20: Serial Presence-Detect EEPROM DC Operating Conditions All voltages referenced DDSPD PARAMETER/CONDITION SUPPLY VOLTAGE INPUT HIGH VOLTAGE: Logic 1; All inputs INPUT LOW VOLTAGE: Logic 0; All inputs OUTPUT LOW VOLTAGE 3mA ...
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Table 22: Serial Presence-Detect Matrix “1”/“0”: Serial Data, “driven to HIGH”/“driven to LOW” BYTE DESCRIPTION 0 Number of Bytes Used by Micron 1 Total Number of SPD Memory Bytes 2 Memory Type 3 Number of Row Addresses 4 Number of ...
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Table 22: Serial Presence-Detect Matrix “1”/“0”: Serial Data, “driven to HIGH”/“driven to LOW” BYTE DESCRIPTION 33 Command Address Hold Data Signal Input Setup Data Signal Input Hold, DH 36–40 Reserved Bytes 41 Device Minimum Active/Auto-Refresh Time, ...
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Figure 11: 168-Pin DIMM Dimensions – 128MB 0.079 (2.00) R (2X 0.118 (3.00) (2X) 0.118 (3.00) TYP 0.250 (6.35) TYP 0.118 (3.00) TYP 2.625 (66.68) PIN 1 (PIN 85 ON BACKSIDE) 0.079 (2.00) R (2X 0.118 ...
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Figure 12: 168-Pin DIMM Dimensions – 256MB 0.079 (2.00 (2X) 0.118 (3.00) (2X) 0.118 (3.00) TYP 0.118 (3.00) TYP 2.625 (66.68) PIN 1 U11 U12 PIN 168 0.079 (2.00) R (2X 0.118 (3.00) (2X) 0.118 ...
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Data Sheet Designation Released (No Mark): This data sheet contains mini- mum and maximum limits specified over the complete power supply and temperature range for production 8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900 E-mail: prodmktg@micron.com, ...