MT16VDDF6464HY-335G2 Micron Technology Inc, MT16VDDF6464HY-335G2 Datasheet - Page 13

MODULE SDRAM DDR 512MB 200SODIMM

MT16VDDF6464HY-335G2

Manufacturer Part Number
MT16VDDF6464HY-335G2
Description
MODULE SDRAM DDR 512MB 200SODIMM
Manufacturer
Micron Technology Inc
Datasheet

Specifications of MT16VDDF6464HY-335G2

Memory Type
DDR SDRAM
Memory Size
512MB
Speed
333MT/s
Package / Case
200-SODIMM
Main Category
DRAM Module
Sub-category
DDR SDRAM
Module Type
200SODIMM
Device Core Size
64b
Organization
64Mx64
Total Density
512MByte
Chip Density
256Mb
Maximum Clock Rate
333MHz
Operating Supply Voltage (typ)
2.5V
Operating Current
1.432A
Number Of Elements
16
Operating Supply Voltage (max)
2.7V
Operating Supply Voltage (min)
2.3V
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
Pin Count
200
Mounting
Socket
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Serial Presence-Detect
Table 12:
Table 13:
Serial Presence-Detect Data
PDF: 09005aef80a77a90/Source: 09005aef80a646bc
DDF16C64_128x64_L_H.fm - Rev. G 8/08 EN
Parameter/Condition
Parameter/Condition
Supply voltage
Input high voltage: Logic 1; All inputs
Input low voltage: Logic 0; All inputs
Output low voltage: I
Input leakage current: V
Output leakage current: V
Standby current: SCL = SDA = V
Power supply current: SCL clock frequency = 100 kHz
SCL LOW to SDA data-out valid
Time the bus must be free before a new transition can start
Data-out hold time
Clock/data fall time
Clock/data rise time
Data-in hold time
Start condition hold time
Clock HIGH period
Noise suppression time constant at SCL, SDA inputs
Clock LOW period
SCL clock frequency
Data-in setup time
Start condition setup time
Stop condition setup time
WRITE cycle time
Serial Presence-Detect EEPROM DC Operating Conditions
Serial Presence-Detect EEPROM AC Operating Conditions
Notes:
OUT
IN
= 3mA
OUT
= GND to V
1. To avoid spurious start and stop conditions, a minimum delay is placed between SCL = 1 and
2. This parameter is sampled.
3. For a restart condition or following a WRITE cycle.
4. The SPD EEPROM WRITE cycle time (
For the latest serial presence-detect data, refer to Micron’s SPD page:
www.micron.com/SPD.
= GND to V
the falling or rising edge of SDA.
sequence to the end of the EEPROM internal ERASE/PROGRAM cycle. During the WRITE
cycle, the EEPROM bus interface circuit is disabled, SDA remains HIGH due to pull-up resis-
tor, and the EEPROM does not respond to its slave address.
DD
- 0.3V; All other inputs = V
DD
DD
13
DD
512MB, 1GB (x64, DR) 200-Pin DDR SODIMM
or V
t
WRC) is the time from a valid stop condition of a write
SS
Micron Technology, Inc., reserves the right to change products or specifications without notice.
t
Symbol
t
t
t
t
Symbol
HD:DAT
HD:STA
SU:DAT
SU:STA
SU:STO
V
t
t
t
t
HIGH
LOW
f
WRC
t
t
BUF
DD SPD
SCL
V
AA
DH
V
t
V
I
I
t
I
t
I
LO
R
SB
CC
F
I
OL
LI
IH
IL
V
Min
200
100
DD SPD
0.2
1.3
0.6
0.6
1.3
0.6
0.6
0
Min
–1.0
2.3
× 0.7 V
Serial Presence-Detect
Max
300
300
400
©2003 Micron Technology, Inc. All rights reserved
0.9
50
10
V
DD SPD
DD SPD
Max
3.6
0.4
2.0
10
10
30
Units
+ 0.5
× 0.3
kHz
ms
µs
µs
ns
ns
ns
µs
µs
µs
ns
µs
ns
µs
µs
Units
Notes
mA
µA
µA
µA
V
V
V
V
1
2
2
3
4

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