AFBR-5103TZ Avago Technologies US Inc., AFBR-5103TZ Datasheet - Page 9
AFBR-5103TZ
Manufacturer Part Number
AFBR-5103TZ
Description
TXRX OPT 1X9 100MBPS DUPL ST SIP
Manufacturer
Avago Technologies US Inc.
Datasheet
1.AFBR-5103TZ.pdf
(20 pages)
Specifications of AFBR-5103TZ
Data Rate
100Mbps
Wavelength
1300nm
Applications
General Purpose
Voltage - Supply
4.75 V ~ 5.25 V
Connector Type
ST
Mounting Type
Through Hole
Function
Implement FDDI and ATM at the 100 Mbps/125 MBd rate
Product
Transceiver
Maximum Rise Time
3 ns, 2.2 ns
Maximum Fall Time
3 ns, 2.2 ns
Pulse Width Distortion
0.02 ns
Maximum Output Current
50 mA
Operating Supply Voltage
4.75 V to 5.25 V
Maximum Operating Temperature
+ 70 C
Minimum Operating Temperature
0 C
Package / Case
SIP-9
For Use With
Multimode Glass
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
516-1982
Regulatory Compliance
These transceiver products are intended to enable com-
mercial system designers to develop equipment that com-
plies with the various international regulations governing
certification of Information Technology Equipment. See
the Regulatory Compliance Table for details. Additional
information is available from your Avago Technologies
sales representative.
Electrostatic Discharge (ESD)
There are two design cases in which immunity to ESD
damage is important.
The first case is during handling of the transceiver prior
to mounting it on the circuit board. It is important to use
normal ESD handling precautions for ESD sensitive devices.
These precautions include using grounded wrist straps,
work benches, and floor mats in ESD controlled areas.
The second case to consider is static discharges to the
exterior of the equipment chassis containing the trans-
ceiver parts. To the extent that the duplex SC connector
is exposed to the outside of the equipment chassis it may
be subject to whatever ESD system level test criteria that
the equipment is intended to meet.
Figure 8. Recommended Board Layout Hole Pattern
(8X) 2.54
20.32
.800
.100
20.32
.800
TOP VIEW
Electromagnetic Interference (EMI)
Most equipment designs utilizing these high speed trans-
ceivers from Avago Technologies will be required to meet
the requirements of FCC in the United States, CENELEC
EN55022 (CISPR 22) in Europe and VCCI in Japan.
These products are suitable for use in designs ranging
from a desktop computer with a single transceiver to a
concentrator or switch product with a large number of
transceivers.
In all well-designed chassis, two 0.5” holes for ST connec-
tors to protrude through will provide 4.6 dB more shield-
ing than one 1.2” duplex SC rectangular cutout. Thus, in
a well-designed chassis, the duplex ST 1x9 transceiver
emissions will be identical to the duplex SC 1x9 transceiver
emissions.
(9X) ∅
(2X) ∅
¯0.000
¯0.000
.075 ± .004
.032 ± .004
1.9 ± 0.1
0.8 ± 0.1
M A
M A
-A-