AFCT-5963TGZ Avago Technologies US Inc., AFCT-5963TGZ Datasheet - Page 9

• Manufacturer Part Number: AFCT-5963TGZ
• Description: TXRX OPT SM SONET OC3/SDH 2X5
• Manufacturer: Avago Technologies US Inc.
• Series: METRAKr

Specifications of AFCT-5963TGZ

• Applications: General Purpose
• Data Rate: 155Mbps
• Wavelength: 1300nm
• Voltage - Supply: 3.1 V ~ 3.5 V
• Connector Type: LC Duplex
• Mounting Type: Through Hole
• Data Rate Max: 0.155Gbps
• Supply Voltage: 3.3V
• Wavelength Typ: 1300nm
• Leaded Process Compatible: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Signal Detect
The Signal Detect circuit provides a de-asserted
output signal when the optical link is broken
(or when the remote transmitter is OFF). The
Signal Detect threshold is set to transition
from a high to low state between the minimum
r e c e i v e r
-45 dBm avg. input optical power indicating a
definite optical fault (e.g. unplugged connector
for the receiver or transmitter, broken fiber,
or failed far-end transmitter or data source).
The Signal Detect does not detect receiver
data error or error-rate. Data errors can be
determined by signal processing offered by
upstream PHY ICs.
Electromagnetic Interference (EMI)
One of a circuit board designer’s foremost
concerns is the control of electromagnetic
emissions from electronic equipment. Success
in controlling generated Electromagnetic
Interference (EMI) enables the designer to pass
a governmental agency’s EMI regulatory
standard and more importantly, it reduces the
possibility of interference to neighboring
equipment. Avago Technologies has designed
the AFCT-5963TLZ/TGZ/ATLZ/ATGZ/NLZ/NGZ to
provide excellent EMI performance. The EMI
performance of a chassis is dependent on
Figure 7. Recommended Board Layout Hole Pattern
(0.525)
9
(0.299)
13.34
7.59
2 x Ø 2.29 MAX.
(0.118)
3
(0.09)
(0.055 ±0.004)
2 x Ø 1.4 ±0.1
*4
i n p u t
(0.236)
(0.118)
6
3
o p t i c a l
(0.28)
7.11
(0.18)
4.57
(0.700)
(0.055 ±0.004)
17.8
2 x Ø 1.4 ±0.1
4 x 1.78
(0.07)
p o w e r
(0.121)
a n d
3.08
(0.079)
(0.14)
3.56
2
10.16
(0.4)
(0.378)
9.59
10 x Ø 0.81 ±0.1
(0.032 ±0.004)
2 x Ø 2.29
(0.09)
physical design and features which help improve
EMI suppression. Avago Technologies encourages
using standard RF suppression practices and
avoiding poorly EMI-sealed enclosures.
Avago Technologies’ OC-3 LC transceivers
(AFCT-5963TLZ/TGZ/ATLZ/ATGZ/NLZ/NGZ) have
nose shields which provide a convenient chassis
connection to the nose of the transceiver.
T h i s n o s e s h i e l d i m p r o v e s s y s t e m E M I
performance by effectively closing off the LC
aperture. Localized shielding is also improved
by tying the four metal housing package
grounding tabs to signal ground on the PCB.
Though not obvious by inspection, the nose
shield and metal housing are electrically
separated for customers who do not wish to
directly tie chassis and signal grounds together.
The recommended transceiver position, PCB
layout and panel opening for these devices
are the same, making them mechanically drop-
i n c o m p a t i b l e .
recommended positioning of the transceivers
with respect to the PCB and faceplate.
Recommended Solder and Wash Process
The AFCT-5963TLZ/TGZ/ATLZ/ATGZ/NLZ/NGZ
are compatible with industry-standard wave
solder processes.
(0.055 ±0.004)
4 x Ø 1.4 ±0.1
(0.079)
*5
2
DIMENSIONS IN MILLIMETERS (INCHES)
NOTES:
1. THIS
2. THE HATCHED AREAS ARE KEEP-OUT AREAS
3. 2 x 5 TRANSCEIVER MODULE REQUIRES 16
*4. THE MOUNTING STUDS SHOULD BE
*5. HOLES FOR OPTIONAL HOUSING LEADS MUST
RECOMMENDED CIRCUIT BOARD LAYOUT FOR
THE SFF TRANSCEIVER.
RESERVED FOR HOUSING STANDOFFS. NO
METAL TRACES OR GROUND CONNECTION IN
KEEP-OUT AREAS.
PCB HOLES (10 I/O PINS, 2 SOLDER POSTS
AND 4 OPTIONAL PACKAGE GROUNDING
TABS). PACKAGE GROUNDING TABS SHOULD
BE CONNECTED TO SIGNAL GROUND.
SOLDERED TO CHASSIS GROUND FOR
MECHANICAL INTEGRITY AND TO ENSURE
FOOTPRINT COMPATIBILITY WITH OTHER SFF
TRANSCEIVERS.
BE TIED TO SIGNAL GROUND.
F i g u r e 8 s h o w s t h e
FIGURE
DESCRIBES
MSA