AFBR-5205Z Avago Technologies US Inc., AFBR-5205Z Datasheet - Page 9
![TXRX ATM/SONET/OC-3 SC 1X9](/photos/26/68/266864/afbr-5205z_5805tz_wht_sml.jpg)
AFBR-5205Z
Manufacturer Part Number
AFBR-5205Z
Description
TXRX ATM/SONET/OC-3 SC 1X9
Manufacturer
Avago Technologies US Inc.
Datasheet
1.AFBR-5205ATZ.pdf
(21 pages)
Specifications of AFBR-5205Z
Data Rate
155Mbps
Wavelength
1310nm
Applications
Ethernet
Voltage - Supply
4.75 V ~ 5.25 V
Connector Type
SC
Mounting Type
Through Hole
Function
Provides the system designer with products to implement a range of soluntions for multimode fiber SONET OC-3 (SDH STM-1)
Product
Transceiver
Maximum Rise Time
3 ns, 2.2 ns
Maximum Fall Time
3 ns, 2.2 ns
Pulse Width Distortion
0.04 ns, 1 ns
Maximum Output Current
50 mA
Operating Supply Voltage
4.75 V to 5.25 V
Maximum Operating Temperature
+ 70 C
Minimum Operating Temperature
0 C
Package / Case
SIP-9
For Use With
Multimode Glass
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
AFBR-5205Z
Manufacturer:
LINEAR
Quantity:
1 630
Part Number:
AFBR-5205Z
Manufacturer:
AVAGO/安华高
Quantity:
20 000
Solder and Wash Process
Compatibility
The transceivers are delivered
with protective process plugs
inserted into the duplex SC or
duplex ST connector receptacle.
This process plug protects the
Figure 7. Recommended decoupling and termination circuits.
9
TERMINATION
AT PHY
DEVICE
INPUTS
NOTES:
THE SPLIT-LOAD TERMINATIONS FOR ECL SIGNALS NEED TO BE LOCATED AT THE INPUT
R1 = R4 = R6 = R8 = R10 = 130 OHMS.
R2 = R3 = R5 = R7 = R9 = 82 OHMS.
C1 = C2 = C3 = C5 = C6 = 0.1 µF.
C4 = 10 µF.
L1 = L2 = 1 µH COIL OR FERRITE INDUCTOR.
OF DEVICES RECEIVING THOSE ECL SIGNALS. RECOMMEND 4-LAYER PRINTED CIRCUIT
BOARD WITH 50 OHM MICROSTRIP SIGNAL PATHS BE USED.
NO INTERNAL CONNECTION
V
Rx
R6
1
EE
RD
R5
RD
2
V
CC
C6
Rx
RD
RD
R7
3
R8
SD
SD
4
AFBR-520xZ
TOP VIEW
R10
R9
C1
TRANSCEIVER
V
AT V
C3
V
Rx
CC
5
CC
L1
V
CC
FILTER
CC
PINS
NO INTERNAL CONNECTION
V
Tx
CC
6
C4
L2
C2
optical subassemblies during
wave solder and aqueous wash
processing and acts as a dust
cover during shipping.
These transceivers are compatible
with either industry standard
wave or hand solder processes.
TD
Tx
7
TD
TERMINATION
AT TRANSCEIVER
INPUTS
R1
TD
R2
8
V
CC
V
Tx
C5
R3
EE
9
R4
TD
Shipping Container
The transceiver is packaged in a
shipping container designed to
protect it from mechanical and
ESD damage during shipment or
storage.