HLMP-EG08-X1000 Avago Technologies US Inc., HLMP-EG08-X1000 Datasheet - Page 13

LED 5MM 635NM RED WATER CLEAR

HLMP-EG08-X1000

Manufacturer Part Number
HLMP-EG08-X1000
Description
LED 5MM 635NM RED WATER CLEAR
Manufacturer
Avago Technologies US Inc.
Type
Uni-Colorr
Datasheet

Specifications of HLMP-EG08-X1000

Viewing Angle
Package / Case
Radial - 2 Lead
Color
Red
Luminous Flux @ Current - Test
500 mlm
Millicandela Rating
14100mcd
Current - Test
20mA
Wavelength - Dominant
626nm
Wavelength - Peak
635nm
Voltage - Forward (vf) Typ
1.9V
Lens Type
Clear
Lens Style/size
Round, 5mm, T-1 3/4
Height
8.71mm
Mounting Type
Through Hole
Resistance Tolerance
626nm
Led Size
T-1 3/4
Illumination Color
Red
Lens Color/style
Untinted Non-Diffused
Operating Voltage
1.9 V
Wavelength
626 nm
Luminous Intensity
7200 mcd to 21000 mcd
Operating Current
20 mA
Lens Dimensions
5 mm
Lens Shape
Dome
Maximum Operating Temperature
+ 100 C
Minimum Operating Temperature
- 40 C
Mounting Style
Through Hole
Package Type
T-1 3/4
Emitting Color
Red
Test Current (it)
20mA
Forward Current
50mA
Dominant Wave Length
626nm
Luminous Flux
0.5lm
Forward Voltage
2.4V
Product Length (mm)
5.8mm
Product Height (mm)
8.71mm
Product Depth (mm)
5.8mm
Mounting
Through Hole
Peak Wavelength
635nm
Shape Type
Circular
Chip Material
AlGaInP
Main Category
Standard LED
Number Of Elements
1
Pin Count
2
Operating Temperature Classification
Industrial
Operating Temp Range
-40C to 100C
Reverse Voltage
20V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
516-1376

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HLMP-EG08-X1000
Manufacturer:
AVAGO
Quantity:
50 000
Refer to application note AN5334 for m­ore inform­ation about soldering and handling of high brightness TH LED lam­ps.
Example of Wave Soldering Temperature Profile for TH LED
Figure 10. Recommended wave soldering profile
Ammo Pack Drawing
13
(0.7087 ± 0.0197)
18.00 ± 0.50
250
200
150
100
ALL DIMENSIONS IN MILLIMETERS (INCHES).
NOTE: THE AMMO-PACKS DRAWING IS APPLICABLE FOR PACKAGING OPTION -DD & -ZZ AND REGARDLESS OF STANDOFF OR NON-STANDOFF.
50
0
(0.3593 ± 0.0246)
9.125 ± 0.625
10
(0.25 ± 0.0512)
6.35 ± 1.30
20
30
PREHEAT
TURBULENT WAVE
(0.50 ± 0.0118)
12.70 ± 0.30
40
TIME (MINUTES)
(0.50 ± 0.0394)
12.70 ± 1.00
CATHODE
50
(0.0276 ± 0.0079)
0.70 ± 0.20
60
70
A
VIEW A–A
LAMINAR WAVE
80
HOT AIR KNIFE
A
90
100
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature:
245°C± 5°C (maximum peak
temperature = 250°C)
Dwell time: 1.5 sec - 3.0 sec
(maximum = 3sec)
Note: Allow for board to be sufficiently
cooled to room temperature before
exerting mechanical force.
(0.1575 ± 0.008)
4.00 ± 0.20
TYP.
(0.807 ± 0.039)
20.50 ± 1.00

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