HSME-C120 Avago Technologies US Inc., HSME-C120 Datasheet - Page 9

• Manufacturer Part Number: HSME-C120
• Description: LED CHIP ALINGAP GREEN RA MOUNT
• Manufacturer: Avago Technologies US Inc.

Specifications of HSME-C120

• Viewing Angle: 155°
• Color: Green
• Millicandela Rating: 52mcd
• Current - Test: 20mA
• Wavelength - Dominant: 572nm
• Wavelength - Peak: 570nm
• Voltage - Forward (vf) Typ: 2.1V
• Lens Type: Clear
• Lens Style/size: Rectangle, 1.2mm x 0.6mm
• Package / Case: 0603 (1608 Metric)
• Size / Dimension: 1.60mm L x 1.00mm W
• Height: 0.60mm
• Mounting Type: Surface Mount, Right Angle
• Resistance Tolerance: 572nm
• Illumination Color: Green
• Wavelength: 572 nm
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Luminous Flux @ Current - Test: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

Figure 5e. Relative intensity vs. angle for HSMx-C265.
Figure 7. Recommended Pb-free reflow soldering profile.
Note:
1. All dimensions in millimeters (inches).
0.4 (0.016)
Figure 9. Recommended soldering pattern for HSMx-C120.
Figure 11. Recommended soldering pattern for
HSMx-C170 and HSMx-C177.
(0.047)
0.15 (0.006)
1.2
100
HSME-C110 fig 10
90
80
70
60
50
40
30
20
10
0
-90
217 °C
200 °C
150 °C
(0.035)
0.9
-80
-70
(0.047)
1.2
3 °C/SEC. MAX.
3 °C/SEC. MAX.
-60
(0.031)
60 - 120 SEC.
0.8
-50
255 - 260 °C
HSME-C110 fig 8
1.2 (0.047)
-40
-30
TIME
(0.047)
1.2
-20
HSME-C110 fig 5e
-10
0.4 (0.016)
ANGLE
0
(0.031)
100 SEC. MAX.
(Acc. to J-STD-020C)
10 - 30 SEC.
0.8
10
6 °C/SEC. MAX.
20 30
Figure 12. Recommended soldering pattern for
HSMx-C190, HSMx-C191 and HSMx-C197.
(0.031)
0.8
CENTERING
BOARD
0.7 (0.028)
40
50
(0.028)
HSME-C110 fig 11
0.7
60
70
80
(0.031)
Figure 10. Recommended soldering pattern for HSMx-C110.
Figure 8. Recommended soldering pattern for HSMx-C265.
0.9 (0.035)
0.8
0.8 (0.031)
90
0.2 (0.008)
(0.055)
1.4
HSME-C110 fig 7
(0.091)
Figure 6. Recommended reflow soldering profile.
2.3
(0.059)
1.5
HSME-C110 fig 9
140-160°C
2.2 (0.087) DIA. PCB HOLE
(0.055)
5.0 (0.200)
Figure 13. Recommended soldering pattern for
HSMx-C150.
1.4
(0.079)
2.0
OVER 2 MIN.
(0.059)
10 SEC. MAX.
4°C/SEC.
1.5
230°C MAX.
MAX.
HSME-C110 fig 12
0.9 (0.035)
1.25 (0.049)
(0.059)
TIME
1.5
(0.079)
2.0
4°C/SEC. MAX.
1.0 (0.039)
(0.059)
1.5
CENTERING
BOARD
–3°C/SEC.
1.5 (0.059)