HLMP-AM87-TW000 Avago Technologies US Inc., HLMP-AM87-TW000 Datasheet - Page 9

• Manufacturer Part Number: HLMP-AM87-TW000
• Description: LED 5MM OVAL GRN DIF W/STANDOFF
• Manufacturer: Avago Technologies US Inc.

Specifications of HLMP-AM87-TW000

• Color: Green
• Luminous Flux @ Current - Test: 3 lm
• Millicandela Rating: 4850mcd
• Current - Test: 20mA
• Wavelength - Dominant: 525nm
• Wavelength - Peak: 516nm
• Voltage - Forward (vf) Typ: 3.3V
• Lens Type: Diffused, Green Tinted
• Lens Style/size: Oval, 5mm
• Package / Case: Radial - 2 Lead
• Height: 8.70mm
• Mounting Type: Through Hole
• Resistance Tolerance: 525nm
• Bulb Size: T-1 3/4 (5mm)
• Led Color: Green
• Luminous Intensity: 7.2cd
• Forward Current If: 20mA
• Forward Voltage: 3.3V
• Led Mounting: Through Hole
• Lens Shape: Oval
• Wavelength Typ: 540nm
• Length/height, External: 8.7mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Viewing Angle: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 516-1697

Precautions:
Lead Forming:
• The leads of an LED lamp may be preformed or cut to
• For better control, it is recommended to use proper tool
• If manual lead cutting is necessary, cut the leads after
Soldering and Handling:
• Care must be taken during PC� assembly and soldering
• LED component may be effectively hand soldered to
• ESD precaution must be properly applied on the solder-
• Recommended soldering condition:
��ote:
1) Above conditions refers to measurement with thermocouple mounted
�) It is recommended to use only bottom preheaters in order to reduce
• Wave soldering parameters must be set and maintained
9
length prior to insertion and soldering on PC board.
to precisely form and cut the leads to applicable length
rather than doing it manually.
the soldering process. The solder connection forms a
mechanical ground which prevents mechanical stress
due to lead cutting from traveling into LED package.
This is highly recommended for hand solder operation,
as the excess lead length also acts as small heat sink.
process to prevent damage to the LED component.
PC�. However, it is only recommended under unavoid-
able circumstances such as rework. The closest manual
soldering distance of the soldering heat source (sol-
dering iron’s tip) to the body is 1.�9mm. Soldering the
LED using soldering iron tip closer than 1.�9mm might
damage the LED.
ing station and personnel to prevent ESD damage to the
LED component that is ESD sensitive. Do refer to Avago
application note A�� 11�� for details. The soldering iron
used should have grounded tip to ensure electrostatic
charge is properly grounded.
at the bottom of PC�.
thermal stress experienced by LED.
according to the recommended temperature and dwell
time. Customer is advised to perform daily check on the
soldering profile to ensure that it is always conforming
to recommended soldering conditions.
Pre-heat temperat�re
Preheat time
Peak temperat�re
�well time
Wave
Soldering
105 °C Max.
60 sec Max
250 °C Max.
3 sec Max.
1.�9mm
[1, 2]
Manual Solder
Dipping
-
-
260 °C Max.
5 sec Max
��ote:
1. PC� with different size and design (component density) will have
�. Avago Technologies’ high brightness LED are using high efficiency
Avago Technologies LED configuration
• Any alignment fixture that is being applied during wave
• At elevated temperature, LED is more susceptible to
• If PC� board contains both through hole (TH) LED and
• Recommended PC board plated through holes (PTH)
• Over-sizing the PTH can lead to twisted LED after clinch-
different heat mass (heat capacity). This might cause a change in tem-
perature experienced by the board if same wave soldering setting is
used. So, it is recommended to re-calibrate the soldering profile again
before loading a new type of PC�.
LED die with single wire bond as shown below. Customer is advised
to take extra precaution during wave soldering to ensure that the
maximum wave temperature does not exceed ��0°C and the solder
contact time does not exceeding 3sec. Over-stressing the LED during
soldering process might cause premature failure to the LED due to
delamination.
��ote: Electrical connection between bottom surface of LED die and
the lead frame is achieved through conductive paste.
soldering should be loosely fitted and should not apply
weight or force on LED. ��on metal material is recom-
mended as it will absorb less heat during wave solder-
ing process.
mechanical stress. Therefore, PC� must allowed to cool
down to room temperature prior to handling, which
includes removal of alignment fixture or pallet.
other surface mount components, it is recommended
that surface mount components be soldered on the top
side of the PC�. If surface mount need to be on the bot-
tom side, these components should be soldered using
reflow soldering prior to insertion the TH LED.
size for LED component leads.
ing. On the other hand under sizing the PTH can cause
difficulty inserting the TH LED.
LED component
lead size
0.45 x 0.45 mm
(0.018x 0.018 inch)
0.50 x 0.50 mm
(0.020x 0.020 inch)
AlInGaP Device
CATHODE
Diagonal
0.636 mm
(0.025 inch)
0.707 mm
(0.028 inch)
ANODE
InGaN Device
Plated through
hole diameter
0.98 to 1.08 mm
(0.039 to 0.043 inch)
1.05 to 1.15 mm
(0.041 to 0.045 inch)