FW300C1 Lineage Power, FW300C1 Datasheet - Page 15

• Manufacturer Part Number: FW300C1
• Description: CONVERTER DC/DC 15V 300W OUT
• Manufacturer: Lineage Power
• Series: FW300r
• Type: Isolated with Remote On/Offr

Specifications of FW300C1

• Output: 15V
• Number Of Outputs: 1
• Power (watts): 300W
• Mounting Type: Through Hole
• Voltage - Input: 36 ~ 75V
• Package / Case: Module
• 1st Output: 15 VDC @ 20A
• Size / Dimension: 4.60" L x 2.40" W x 0.53" H (116.8mm x 61mm x 13.5mm)
• Power (watts) - Rated: 300W
• Operating Temperature: -40°C ~ 100°C
• Efficiency: 87%
• Approvals: CE, CSA, UL, VDE
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• 3rd Output: -
• 2nd Output: -
• 4th Output: -

April 2008
Thermal Considerations
Heat Transfer with Heat Sinks
Example
If an 85 °C case temperature is desired, what is the
minimum airflow necessary? Assume the FW300C1
module is operating at nominal line and an output cur-
rent of 20 A, maximum ambient air temperature of
40 °C, and the heat sink is 1/2 inch.
Solution
Given: V
Determine P
Then solve the following equation:
Use Figures 21 and 22 to determine air velocity for the
0.5 inch heat sink. The minimum airflow necessary for
the FW250C1 module depends on heat sink fin orienta-
tion and is shown below:
n
n
Lineage Power
2.0 m/s (400 ft./min.) (oriented along width)
3.0 m/s (600 ft./min.) (oriented along length)
θ
θ
θ
ca
ca
ca
I
T
T
Heat sink = 1/2 inch
P
O
=
=
=
A
C
I
D
= 20 A
= 54 V
= 40 °C
= 85 °C
= 42 W
1.07
D
(
----------------------- -
(
----------------------- -
T
85 40
by using Figure 24:
C
P
42
–
°C/W
–
D
T
A
)
)
dc-dc Converters; 36 to 75 Vdc Input, 15 Vdc Output; 250 W to 300 W
(continued)
(continued)
Custom Heat Sinks
A more detailed model can be used to determine the
required thermal resistance of a heat sink to provide
necessary cooling. The total module resistance can be
separated into a resistance from case-to-sink (θcs) and
sink-to-ambient (θsa) as shown in Figure 24.
Figure 24. Resistance from Case-to-Sink and Sink-
For a managed interface using thermal grease or foils,
a value of θcs = 0.1 °C/W to 0.3 °C/W is typical. The
solution for heat sink resistance is:
This equation assumes that all dissipated power must
be shed by the heat sink. Depending on the user-
defined application environment, a more accurate
model, including heat transfer from the sides and bot-
tom of the module, can be used. This equation pro-
vides a conservative estimate for such instances.
EMC Considerations
For assistance with designing for EMC compliance,
please refer to the FLTR100V10 data sheet
(DS99-294EPS).
Layout Considerations
Copper paths must not be routed beneath the power
module mounting inserts. For additional layout guide-
lines, refer to the FLTR100V10 data sheet
(DS99-294EPS).
θ
sa
=
P
D
to-Ambient
(
------------------------ -
T
C
P
T
–
C
D
T
A
)
–
θcs
θ
cs
T
S
θsa
T
A
8-1304 (F).e
15